Inventor · disambiguated record
Tadanori Shimoto
Also filed as: SHIMOTO TADANORI
27 granted patents·6 pending applications·918 citations·filing 1992–2010
97Inventor score
Top patents by PatentIndex Score
33 records- 0198US7338884B2Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor deviceNEC CORP·Filed 2004·Granted Mar 4, 2008·286 cites·17 claims
- 0297US7397000B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2005·Granted Jul 8, 2008·54 cites·18 claims
- 0392US7294393B2Sheet material and wiring boardNEC CORP·Filed 2005·Granted Nov 13, 2007·22 cites·23 claims
- 0492US6861757B2Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor deviceNEC CORP·Filed 2002·Granted Mar 1, 2005·55 cites·46 claims
- 0591US7566834B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2008·Granted Jul 28, 2009·17 cites·11 claims
- 0691US5830563AInterconnection structures and method of making sameNEC CORP·Filed 1996·Granted Nov 3, 1998·85 cites·9 claims
- 0789US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 0887US6841862B2Semiconductor package board using a metal baseNEC CORP·Filed 2001·Granted Jan 11, 2005·33 cites·25 claims
- 0986US7745736B2Interconnecting substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Jun 29, 2010·15 cites·28 claims
- 1085US6278153B1Thin film capacitor formed in viaNEC CORP·Filed 1999·Granted Aug 21, 2001·62 cites·30 claims
- 1184US7696007B2Semiconductor package board using a metal baseNEC CORP·Filed 2009·Granted Apr 13, 2010·8 cites·21 claims
- 1283US7233066B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2006·Granted Jun 19, 2007·8 cites·7 claims
- 1383US6576499B2Electronic device assembly and a method of connecting electronic devices constituting the sameNEC CORP·Filed 2001·Granted Jun 10, 2003·25 cites·3 claims
- 1481US6798070B2Electronic device assembly and a method of connecting electronic devices constituting the sameNEC CORP·Filed 2000·Granted Sep 28, 2004·23 cites·8 claims
- 1580US7060604B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2003·Granted Jun 13, 2006·21 cites·32 claims
- 1679US7474538B2Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor packageNEC CORP·Filed 2004·Granted Jan 6, 2009·22 cites·38 claims
- 1779US5287208ALiquid crystal device with benzocyclobutene alignment layer and protective coating for electrodesNEC CORP·Filed 1992·Granted Feb 15, 1994·44 cites·4 claims
- 1877US5483101AMultilayer printed circuit boardNEC CORP·Filed 1994·Granted Jan 9, 1996·53 cites·8 claims
- 1972US7816782B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageNEC CORP·Filed 2005·Granted Oct 19, 2010·4 cites·21 claims
- 2066US7585699B2Semiconductor package board using a metal baseNEC CORP·Filed 2006·Granted Sep 8, 2009·2 cites·19 claims
- 2153US5712506ASemiconductor device with passivation layer of benzocyclobutene polymer and silicon powderNEC CORP·Filed 1995·Granted Jan 27, 1998·18 cites·13 claims
- 2247US6444403B1Resin laminated wiring sheet, wiring structure using the same, and production method thereofNEC CORP·Filed 2000·Granted Sep 3, 2002·2 cites·3 claims
- 2347US6204565B1Semiconductor carrier and method for manufacturing the sameNEC CORP·Filed 1999·Granted Mar 20, 2001·13 cites·5 claims
- 2447US5889233AMultilayer wiring structureNEC CORP·Filed 1996·Granted Mar 30, 1999·14 cites·6 claims
- 2544US6156414ACarrier film and process for producing the sameNEC CORP·Filed 1998·Granted Dec 5, 2000·9 cites·3 claims
- 2643US2005098875A1Semiconductor package board using a metal baseNEC CORP·Filed 2004·Application pending·0 cites
- 2742US6150074AMethod of forming electrically conductive wiring patternNEC CORP·Filed 1998·Granted Nov 21, 2000·9 cites·44 claims
- 2842US2007231475A1Conductor structure on dielectric materialSHIMOTO TADANORI·Filed 2006·Application pending·0 cites
- 2940US2002020836A1Thin film capacitor avoiding short circuit between electrodesNEC CORP·Filed 2001·Application pending·0 cites
- 3040US2009001604A1Semiconductor Package and Method for Producing SameTANAKA DAISUKE·Filed 2006·Application pending·0 cites
- 3140US2004089470A1Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrateNEC CORP·Filed 2003·Application pending·0 cites
- 3239US6333136B1Carrier film and process for producing the sameNEC CORP·Filed 2000·Granted Dec 25, 2001·0 cites·1 claims
- 3336US2002024138A1Wiring board for high dense mounting and method of producing the sameNEC CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →