Inventor · disambiguated record
Fei Ying Wong
Also filed as: WONG FEI · WONG FEI Y · WONG FEI-YING
9 granted patents·4 pending applications·73 citations·filing 2002–2022
85Inventor score
Top patents by PatentIndex Score
13 records- 0187US7301225B2Multi-row lead frameFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 27, 2007·20 cites·20 claims
- 0284US12512450B2Semiconductor device and a method of manufacturing a semiconductor deviceNexperia BV·Filed 2022·Granted Dec 30, 2025·1 cites·5 claims
- 0380US6838751B2Multi-row leadframeFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 4, 2005·34 cites·13 claims
- 0479US9418919B2Leadless chip carrier having improved mountabilityGROENHUIS ROELF ANCO JACOB·Filed 2011·Granted Aug 16, 2016·8 cites·15 claims
- 0574US7262494B2Three-dimensional packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 28, 2007·7 cites·7 claims
- 0667US9269690B2Packaged semiconductor device with interior polygonal padsNXP BV·Filed 2013·Granted Feb 23, 2016·3 cites·16 claims
- 0746US12297069B2Electronic component packing reelNexperia BV·Filed 2022·Granted May 13, 2025·0 cites·19 claims
- 0846US11631634B2Leadless semiconductor package and method of manufactureNexperia BV·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 0943US2022262711A1Semiconductor device and a method of manufacturing a semiconductor deviceNexperia BV·Filed 2022·Application pending·0 cites
- 1041US10056343B2Packaged semiconductor device with interior polygonal padsNexperia BV·Filed 2016·Granted Aug 21, 2018·0 cites·10 claims
- 1135US2006208344A1Lead frame panel and method of packaging semiconductor devices using the lead frame panelSHIU HEI M·Filed 2005·Application pending·0 cites
- 1235US2012286399A1Leadframe and method for packaging semiconductor dieBOETTCHER TIM·Filed 2012·Application pending·0 cites
- 1333US2002177254A1Semiconductor package and method for making the sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →