Inventor · disambiguated record
Jung-Seok Ryu
Also filed as: RYU JUNG SEOK
1 granted patent·1 pending application·4 citations·filing 2006–2023
24Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0160US7498679B2Package substrate and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 3, 2009·4 cites·6 claims
- 0245US2024055421A1Method for manufacturing semiconductor devices without thickness deviationSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →