Inventor · disambiguated record
Makoto Totani
Also filed as: TOTANI MAKOTO
16 granted patents·1 pending application·376 citations·filing 1996–2021
94Inventor score
Top patents by PatentIndex Score
17 records- 0191US6449836B1Method for interconnecting printed circuit boards and interconnection structureDENSO CORP·Filed 2000·Granted Sep 17, 2002·78 cites·29 claims
- 0287US5783865AWiring substrate and semiconductor deviceFUJITSU LTD·Filed 1996·Granted Jul 21, 1998·96 cites·7 claims
- 0382US6023098ASemiconductor device having terminals for heat radiationFUJITSU LTD·Filed 1996·Granted Feb 8, 2000·72 cites·12 claims
- 0480US6784375B2Interconnection structure for interconnecting printed circuit boardsDENSO CORP·Filed 2002·Granted Aug 31, 2004·23 cites·25 claims
- 0579US6499217B1Method of manufacturing three-dimensional printed wiring boardMITSUBISHI PLASTICS INC·Filed 2000·Granted Dec 31, 2002·27 cites·6 claims
- 0675US7168326B2Compact pressure sensor with high corrosion resistance and high accuracyDENSO CORP·Filed 2005·Granted Jan 30, 2007·4 cites·20 claims
- 0775US6966482B2Connecting structure of printed circuit boardsDENSO CORP·Filed 2003·Granted Nov 22, 2005·17 cites·10 claims
- 0872US6527162B2Connecting method and connecting structure of printed circuit boardsDENSO CORP·Filed 2001·Granted Mar 4, 2003·15 cites·14 claims
- 0968US7176541B2Pressure sensorDENSO CORP·Filed 2005·Granted Feb 13, 2007·7 cites·12 claims
- 1063US7417195B2Circuit board and circuit board connection structureDENSO CORP·Filed 2004·Granted Aug 26, 2008·10 cites·17 claims
- 1162US11985762B2Flexible laminated board and multilayer circuit boardUBE EXSYMO CO LTD·Filed 2021·Granted May 14, 2024·0 cites·4 claims
- 1262US7080445B2Method for connecting printed circuit boards and connected printed circuit boardsDENSO CORP·Filed 2002·Granted Jul 25, 2006·11 cites·21 claims
- 1355US7242065B2Compact pressure sensor with high corrosion resistance and high accuracyDENSO CORP·Filed 2005·Granted Jul 10, 2007·3 cites·12 claims
- 1454US2017318670A1Flexible laminated board and multilayer circuit boardUBE EXSYMO CO LTD·Filed 2016·Application pending·0 cites
- 1545US7240426B2Equipment for bonding printed circuit boardsDENSO WAVE INC·Filed 2004·Granted Jul 10, 2007·3 cites·6 claims
- 1641US6038135AWiring board and semiconductor deviceFUJITSU LTD·Filed 1996·Granted Mar 14, 2000·9 cites·13 claims
- 1729US6282098B1Electronic circuit module, electronic circuit module connecting structure and connecting member, and method for connecting the sameFUJITSU LTD·Filed 1999·Granted Aug 28, 2001·1 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →