Inventor · disambiguated record
Jan Proschwitz
Also filed as: PROSCHWITZ JAN
9 granted patents·14 pending applications·34 citations·filing 2013–2023
85Inventor score
Top patents by PatentIndex Score
23 records- 0194US9627804B2Snap button fastener providing electrical connectionINTEL CORP·Filed 2014·Granted Apr 18, 2017·18 cites·7 claims
- 0289US11342720B2Snap button fastener providing electrical connectionINTEL CORP·Filed 2020·Granted May 24, 2022·2 cites·30 claims
- 0387US10886680B2Snap button fastener providing electrical connectionINTEL CORP·Filed 2019·Granted Jan 5, 2021·3 cites·9 claims
- 0485US10193288B2Snap button fastener providing electrical connectionINTEL CORP·Filed 2017·Granted Jan 29, 2019·5 cites·14 claims
- 0579US8786105B1Semiconductor device with chip having low-k-layersMEYER THORSTEN·Filed 2013·Granted Jul 22, 2014·5 cites·30 claims
- 0678US11990408B2WLCSP reliability improvement for package edges including package shieldingINTEL CORP·Filed 2020·Granted May 21, 2024·1 cites·16 claims
- 0775US11804683B2Snap button fastener providing electrical connectionINTEL CORP·Filed 2022·Granted Oct 31, 2023·0 cites·28 claims
- 0858US2025201761A1Self-aligning semiconductor constructionINTEL CORP·Filed 2023·Application pending·0 cites
- 0957US9921694B2Wearable computing deviceINTEL CORP·Filed 2014·Granted Mar 20, 2018·0 cites·4 claims
- 1054US2025210456A1Active Cooling for Heterogenous PackagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1153US2018150156A1Wearable computing deviceINTEL CORP·Filed 2018·Application pending·0 cites
- 1253US2025112206A1Die placement within a formed cavity on a redistribution layerINTEL CORP·Filed 2023·Application pending·0 cites
- 1350US2023282546A1Packaging architecture with active coolingWAIDHAS BERND·Filed 2022·Application pending·0 cites
- 1449US2023307300A1Package layers for stress monitoring and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 1549US2023317544A1Integrated circuit packages having reduced z-height and heat pathINTEL CORP·Filed 2022·Application pending·0 cites
- 1649US2023317562A1Dual-sided terminal device with split signal and power routingINTEL CORP·Filed 2022·Application pending·0 cites
- 1749US2023300975A1Integrated circuit packages having reduced z-heightINTEL CORP·Filed 2022·Application pending·0 cites
- 1848US2023317681A1Three-dimensional stack cooling wingsINTEL CORP·Filed 2022·Application pending·0 cites
- 1948US2023299032A1Microelectronic assemblies including nanowire and solder interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 2048US2023317551A1Heterogeneous packages having thermal towersINTEL CORP·Filed 2022·Application pending·0 cites
- 2147US2023299043A1Packaging architecture with thermally conductive integrated circuit bridgeINTEL CORP·Filed 2022·Application pending·0 cites
- 2246US2023282615A1Stacked die packaging architecture with conductive vias on interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 2337US10347558B2Low thermal resistance hanging die packageINTEL IP CORP·Filed 2015·Granted Jul 9, 2019·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →