Inventor · disambiguated record
Chirag S. Patel
Also filed as: PATEL CHIRAG · PATEL CHIRAG S · PATEL CHIRAG SURYAKANT
33 granted patents·5 pending applications·806 citations·filing 2000–2012
98Inventor score
Top patents by PatentIndex Score
38 records- 0198US7488680B2Conductive through via process for electronic device carriersIBM·Filed 2005·Granted Feb 10, 2009·87 cites·11 claims
- 0297US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0395US7230334B2Semiconductor integrated circuit chip packages having integrated microchannel cooling modulesIBM·Filed 2004·Granted Jun 12, 2007·66 cites·25 claims
- 0494US8405226B2Semiconductor device and method of making semiconductor deviceKNICKERBOCKER JOHN U·Filed 2012·Granted Mar 26, 2013·17 cites·11 claims
- 0592US7808798B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2008·Granted Oct 5, 2010·27 cites·14 claims
- 0692US7518229B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2006·Granted Apr 14, 2009·31 cites·3 claims
- 0791US7033927B2Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a waferIBM·Filed 2004·Granted Apr 25, 2006·76 cites·6 claims
- 0890US8290008B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2009·Granted Oct 16, 2012·18 cites·12 claims
- 0990US7948077B2Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangementIBM·Filed 2008·Granted May 24, 2011·13 cites·19 claims
- 1090US7518225B2Chip system architecture for performance enhancement, power reduction and cost reductionIBM·Filed 2006·Granted Apr 14, 2009·15 cites·18 claims
- 1190US6528349B1Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testabilityGEORGIA TECH RES INST·Filed 2000·Granted Mar 4, 2003·69 cites·21 claims
- 1289US8755644B2Silicon based optical viasBUDD RUSSELL A·Filed 2008·Granted Jun 17, 2014·16 cites·44 claims
- 1388US7888786B2Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling deviceIBM·Filed 2007·Granted Feb 15, 2011·11 cites·19 claims
- 1487US8143726B2Semiconductor device and method of making semiconductor deviceKNICKERBOCKER JOHN U·Filed 2009·Granted Mar 27, 2012·11 cites·12 claims
- 1586US7352066B2Silicon based optical viasIBM·Filed 2003·Granted Apr 1, 2008·43 cites·10 claims
- 1686US6690081B2Compliant wafer-level packaging devices and methods of fabricationGEORGIA TECH RES INST·Filed 2001·Granted Feb 10, 2004·44 cites·54 claims
- 1785US7855442B2Silicon based packageIBM·Filed 2007·Granted Dec 21, 2010·10 cites·7 claims
- 1884US8310259B2Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connectionsHAMEL HARVEY·Filed 2008·Granted Nov 13, 2012·12 cites·6 claims
- 1983US8222079B2Semiconductor device and method of making semiconductor deviceKNICKERBOCKER JOHN U·Filed 2007·Granted Jul 17, 2012·9 cites·16 claims
- 2082US8295056B2Silicon carrier structure and method of forming sameANDRY PAUL STEPHEN·Filed 2009·Granted Oct 23, 2012·9 cites·15 claims
- 2181US7456046B2Method to create flexible connections for integrated circuitsIBM·Filed 2005·Granted Nov 25, 2008·8 cites·1 claims
- 2280US6785458B2Guided-wave optical interconnections embedded within a microelectronic wafer-level batch packageGEORGIA TECH RES INST·Filed 2002·Granted Aug 31, 2004·19 cites·13 claims
- 2379US7189595B2Method of manufacture of silicon based package and devices manufactured therebyIBM·Filed 2004·Granted Mar 13, 2007·21 cites·9 claims
- 2476US8097492B2Method and manufacture of silicon based package and devices manufactured therebyMAGERLEIN JOHN H·Filed 2008·Granted Jan 17, 2012·7 cites·10 claims
- 2576US6972243B2Fabrication of semiconductor dies with micro-pins and structures produced therewithIBM·Filed 2003·Granted Dec 6, 2005·19 cites·21 claims
- 2672US8173541B2Chip carrier substrate including capacitor and method for fabrication thereofANDRY PAUL S·Filed 2009·Granted May 8, 2012·4 cites·18 claims
- 2770US8148255B2Techniques for forming solder bump interconnectsDANG BING·Filed 2007·Granted Apr 3, 2012·2 cites·19 claims
- 2869US6954576B2Guided-wave optical interconnections embedded within a microelectronic wafer-level batch packageGEORGIA TECH RES INST·Filed 2004·Granted Oct 11, 2005·9 cites·10 claims
- 2965US7820521B2Conductive through via structure and process for electronic device carriersIBM·Filed 2008·Granted Oct 26, 2010·1 cites·30 claims
- 3063US9159616B2Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connectionsHAMEL HARVEY·Filed 2012·Granted Oct 13, 2015·1 cites·7 claims
- 3156US8328156B2Techniques for forming solder bump interconnectsDANG BING·Filed 2012·Granted Dec 11, 2012·0 cites·2 claims
- 3256US7132736B2Devices having compliant wafer-level packages with pillars and methods of fabricationGEORGIA TECH RES INST·Filed 2002·Granted Nov 7, 2006·7 cites·6 claims
- 3353US2008217778A1Method to create flexible connections for integrated circuitsIBM·Filed 2008·Application pending·0 cites
- 3452US2008029889A1Method to create flexible connections for integrated circuitsIBM·Filed 2007·Application pending·0 cites
- 3551US7719079B2Chip carrier substrate capacitor and method for fabrication thereofIBM·Filed 2007·Granted May 18, 2010·0 cites·7 claims
- 3648US2012301977A1Silicon carrier structure and method of forming sameANDRY PAUL STEPHEN·Filed 2012·Application pending·0 cites
- 3747US2006081976A1Fabrication of semiconductor dies with micro-pins and structures produced therewithPATEL CHIRAG S·Filed 2005·Application pending·0 cites
- 3846US2006027934A1Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →