Inventor · disambiguated record
Kurt G. Steiner
Also filed as: STEINER KURT · STEINER KURT G · STEINER KURT GEORGE · STEINER KURT GEROGE
36 granted patents·5 pending applications·713 citations·filing 1991–2024
98Inventor score
Files withAGERE SYSTEMS INC14LUCENT TECHNOLOGIES INC5AGERE SYST GUARDIAN CORP3TRIQUINT SEMICONDUCTOR INC3ABBOTT BENJAMIN P2
Top patents by PatentIndex Score
41 records- 0197US8294331B2Acoustic wave guide device and method for minimizing trimming effects and piston mode instabilitiesABBOTT BENJAMIN P·Filed 2011·Granted Oct 23, 2012·52 cites·26 claims
- 0296US7068139B2Inductor formed in an integrated circuitAGERE SYSTEMS INC·Filed 2004·Granted Jun 27, 2006·66 cites·18 claims
- 0390US10469050B2Guided acoustic wave deviceQORVO US INC·Filed 2017·Granted Nov 5, 2019·8 cites·23 claims
- 0485US8183698B2Bond pad support structure for semiconductor deviceANTOL JOZE E·Filed 2007·Granted May 22, 2012·19 cites·20 claims
- 0584US9331667B2Methods, systems, and apparatuses for temperature compensated surface acoustic wave deviceTRIQUINT SEMICONDUCTOR INC·Filed 2014·Granted May 3, 2016·8 cites·19 claims
- 0684US6008123AMethod for using a hardmask to form an opening in a semiconductor substrateLUCENT TECHNOLOGIES INC·Filed 1997·Granted Dec 28, 1999·77 cites·25 claims
- 0783US7332775B2Protruding spacers for self-aligned contactsAGERE SYSTEMS INC·Filed 2006·Granted Feb 19, 2008·11 cites·20 claims
- 0882US10476481B2Acoustic filtering circuitry including capacitorQORVO US INC·Filed 2017·Granted Nov 12, 2019·4 cites·20 claims
- 0982US8319343B2Routing under bond pad for the replacement of an interconnect layerARCHER III VANCE D·Filed 2006·Granted Nov 27, 2012·13 cites·10 claims
- 1081US6432814B1Method of manufacturing an interconnect structure having a passivation layer for preventing subsequent processing reactionsAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 13, 2002·31 cites·20 claims
- 1181US5891784ATransistor fabrication methodLUCENT TECHNOLOGIES INC·Filed 1995·Granted Apr 6, 1999·70 cites·6 claims
- 1280US6879046B2Split barrier layer including nitrogen-containing portion and oxygen-containing portionAGERE SYSTEMS INC·Filed 2002·Granted Apr 12, 2005·22 cites·13 claims
- 1378US7126198B2Protruding spacers for self-aligned contactsAGERE SYSTEMS INC·Filed 2002·Granted Oct 24, 2006·25 cites·19 claims
- 1478US6798043B2Structure and method for isolating porous low-k dielectric filmsAGERE SYSTEMS INC·Filed 2002·Granted Sep 28, 2004·22 cites·18 claims
- 1577US9209380B2Acoustic wave deviceTRIQUINT SEMICONDUCTOR INC·Filed 2013·Granted Dec 8, 2015·5 cites·9 claims
- 1677US6869873B2Copper silicide passivation for improved reliabilityAGERE SYSTEMS INC·Filed 2003·Granted Mar 22, 2005·26 cites·9 claims
- 1776US6675631B1Method for conducting crash tests using a carriage and corresponding deviceDSD DR STEFFAN DATENTECHNIK GE·Filed 2000·Granted Jan 13, 2004·26 cites·21 claims
- 1876US5200358AIntegrated circuit with planar dielectric layerAT & T BELL LAB·Filed 1991·Granted Apr 6, 1993·58 cites·5 claims
- 1974US6548892B1Low k dielectric insulator and method of forming semiconductor circuit structuresAGERE SYSTEMS INC·Filed 2000·Granted Apr 15, 2003·16 cites·30 claims
- 2070US6362094B1Hydrogenated silicon carbide as a liner for self-aligning contact viasAGERE SYST GUARDIAN CORP·Filed 2000·Granted Mar 26, 2002·20 cites·14 claims
- 2169US6133618ASemiconductor device having an anti-reflective layer and a method of manufacture thereofLUCENT TECHNOLOGIES INC·Filed 1997·Granted Oct 17, 2000·35 cites·8 claims
- 2268US7678639B2Inductor formed in an integrated circuitAGERE SYSTEMS INC·Filed 2008·Granted Mar 16, 2010·3 cites·6 claims
- 2367US8119501B2Method for separating a semiconductor wafer into individual semiconductor dies using an implanted impurityHARRIS EDWARD B·Filed 2009·Granted Feb 21, 2012·2 cites·18 claims
- 2467US6960836B2Reinforced bond padAGERE SYSTEMS INC·Filed 2003·Granted Nov 1, 2005·13 cites·6 claims
- 2564US7541238B2Inductor formed in an integrated circuitAGERE SYSTEMS INC·Filed 2006·Granted Jun 2, 2009·2 cites·10 claims
- 2664US7067419B2Mask layer and dual damascene interconnect structure in a semiconductor deviceAGERE SYSTEMS INC·Filed 2003·Granted Jun 27, 2006·12 cites·19 claims
- 2764US6472307B1Methods for improved encapsulation of thick metal features in integrated circuit fabricationAGERE SYST GUARDIAN CORP·Filed 2000·Granted Oct 29, 2002·10 cites·30 claims
- 2862US8044553B2Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factorTRIQUINT SEMICONDUCTOR INC·Filed 2010·Granted Oct 25, 2011·2 cites·23 claims
- 2960US9973169B2Surface acoustic wave filter with a cap layer for improved reliabilityRF MICRO DEVICES INC·Filed 2015·Granted May 15, 2018·1 cites·18 claims
- 3058US2024258994A1Acoustic wave device with interdigital transducer electrode having seed layerSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 3158US2024275363A1Acoustic wave device with an efficient structure, a radio frequency module, and a mobile device including the sameSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 3255US8552819B2High coupling, low loss saw filter and associated methodABBOTT BENJAMIN P·Filed 2011·Granted Oct 8, 2013·1 cites·16 claims
- 3354US6576980B1Surface treatment anneal of hydrogenated silicon-oxy-carbide dielectric layerAGERE SYSTEMS INC·Filed 1999·Granted Jun 10, 2003·20 cites·14 claims
- 3450US6200734B1Method for fabricating semiconductor devicesLUCENT TECHNOLOGIES INC·Filed 1998·Granted Mar 13, 2001·15 cites·14 claims
- 3549US7081419B2Gate dielectric structure for reducing boron penetration and current leakageAGERE SYSTEMS INC·Filed 2004·Granted Jul 25, 2006·4 cites·23 claims
- 3648US2013056868A1Routing under bond pad for the replacement of an interconnect layerAGERE SYSTEMS LLC·Filed 2012·Application pending·0 cites
- 3745US7566964B2Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structuresAGERE SYSTEMS INC·Filed 2003·Granted Jul 28, 2009·2 cites·7 claims
- 3835US2001012667A1Clustered system and method for formation of integrated circuit devicesFiled 2001·Application pending·0 cites
- 3935US2003119305A1Mask layer and dual damascene interconnect structure in a semiconductor deviceFiled 2001·Application pending·0 cites
- 4033US6140222AIntegrated circuit dielectric formationLUCENT TECHNOLOGIES INC·Filed 1995·Granted Oct 31, 2000·6 cites·4 claims
- 4130US5416033AIntegrated circuit and manufactureAT & T CORP·Filed 1994·Granted May 16, 1995·6 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →