Inventor · disambiguated record
Kunho Song
Also filed as: SONG KUNHO
3 granted patents·3 citations·filing 2009–2016
52Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0159US7989939B2Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 2, 2011·3 cites·14 claims
- 0243US10211084B2Chuck table and substrate processing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·0 cites·20 claims
- 0337US10418259B2Apparatus for laminating a tape film on a substrate and a system of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 17, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →