Inventor · disambiguated record
Meng-Hung Yeh
Also filed as: YEH MENG-HUNG
2 granted patents·1 pending application·0 citations·filing 2013–2014
24Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD3
Top patents by PatentIndex Score
3 records- 0143US9355989B2Wire bonding device and method of eliminating defective bonding wireSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 31, 2016·0 cites·10 claims
- 0238US9289846B2Method for fabricating wire bonding structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 22, 2016·0 cites·7 claims
- 0333US2014191393A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →