Inventor · disambiguated record
William C. Stermer, Jr.
Also filed as: STERMER JR WILLIAM C
3 granted patents·3 citations·filing 2012–2013
54Inventor score
Top patents by PatentIndex Score
3 records- 0163US8890308B2Integrated circuit package and method of forming the sameHOOPER STEPHEN R·Filed 2012·Granted Nov 18, 2014·2 cites·20 claims
- 0257US9510495B2Electronic devices with cavity-type, permeable material filled packages, and methods of their manufactureHOOPER STEPHEN R·Filed 2012·Granted Nov 29, 2016·1 cites·10 claims
- 0336US8962389B2Microelectronic packages including patterned die attach material and methods for the fabrication thereofSTERMER JR WILLIAM C·Filed 2013·Granted Feb 24, 2015·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →