Inventor · disambiguated record
Hideki Mizuhara
Also filed as: MIZUHARA HIDEKI
53 granted patents·20 pending applications·638 citations·filing 1997–2020
98Inventor score
Files withSANYO ELECTRIC CO49KANTO SANYO SEMICONDUCTORS CO4PANASONIC IP MAN CO LTD4USUI RYOSUKE3FUJITA KAZUNORI1
Top patents by PatentIndex Score
73 records- 0196US7405484B2Semiconductor device containing stacked semiconductor chips and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Jul 29, 2008·98 cites·13 claims
- 0288US7315083B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Jan 1, 2008·16 cites·9 claims
- 0388US7221049B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted May 22, 2007·17 cites·9 claims
- 0487US6150725ASemiconductor devices with means to reduce contaminationSANYO ELECTRIC CO·Filed 1998·Granted Nov 21, 2000·99 cites·5 claims
- 0584US8378229B2Circuit board and method for manufacturing semiconductor modules and circuit boardsSANYO ELECTRIC CO·Filed 2010·Granted Feb 19, 2013·7 cites·11 claims
- 0681US6399478B2Method of making a dual damascene structure with modified insulationSANYO ELECTRIC CO·Filed 2001·Granted Jun 4, 2002·31 cites·12 claims
- 0779US7495344B2Semiconductor apparatusSANYO ELECTRIC CO·Filed 2005·Granted Feb 24, 2009·8 cites·3 claims
- 0878US7759581B2Circuit board and method for manufacturing semiconductor modules and circuit boardsSANYO ELECTRIC CO·Filed 2007·Granted Jul 20, 2010·6 cites·15 claims
- 0978US7301228B2Semiconductor device, method for manufacturing same and thin plate interconnect line memberSANYO ELECTRIC CO·Filed 2003·Granted Nov 27, 2007·21 cites·9 claims
- 1077US7364941B2Circuit device manufacturing methodSANYO ELECTRIC CO·Filed 2005·Granted Apr 29, 2008·6 cites·9 claims
- 1174US7855452B2Semiconductor module, method of manufacturing semiconductor module, and mobile deviceSANYO ELECTRIC CO·Filed 2008·Granted Dec 21, 2010·5 cites·3 claims
- 1274US7768132B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Aug 3, 2010·7 cites·8 claims
- 1374US7507658B2Semiconductor apparatus and method of fabricating the apparatusSANYO ELECTRIC CO·Filed 2005·Granted Mar 24, 2009·6 cites·9 claims
- 1473US6690084B1Semiconductor device including insulation film and fabrication method thereofSANYO ELECTRIC CO·Filed 2000·Granted Feb 10, 2004·15 cites·11 claims
- 1573US6235648B1Semiconductor device including insulation film and fabrication method thereofSANYO ELECTRIC CO·Filed 1998·Granted May 22, 2001·41 cites·15 claims
- 1672US7969005B2Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method thereforSANYO ELECTRIC CO·Filed 2008·Granted Jun 28, 2011·4 cites·2 claims
- 1771US8338946B2Semiconductor module, method of manufacturing semiconductor module, and mobile deviceYANASE YASUYUKI·Filed 2010·Granted Dec 25, 2012·3 cites·5 claims
- 1871US5898221ASemiconductor device having upper and lower wiring layersSANYO ELECTRIC CO·Filed 1997·Granted Apr 27, 1999·34 cites·7 claims
- 1970US8283681B2Lighting device and method of manufacturing the sameSAKAMOTO NORIAKI·Filed 2010·Granted Oct 9, 2012·5 cites·9 claims
- 2070US7745938B2Circuit device, a method for manufacturing a circuit device, and a semiconductor moduleSANYO ELECTRIC CO·Filed 2008·Granted Jun 29, 2010·4 cites·11 claims
- 2167US10903359B2Semiconductor devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Jan 26, 2021·1 cites·38 claims
- 2266US8022533B2Circuit apparatus provided with asperities on substrate surfaceSANYO ELECTRIC CO·Filed 2005·Granted Sep 20, 2011·3 cites·4 claims
- 2365US8093699B2Circuit device with circuit board and semiconductor chip mounted thereonKOHARA YASUHIRO·Filed 2005·Granted Jan 10, 2012·3 cites·7 claims
- 2465US7851921B2Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting boardSANYO ELECTRIC CO·Filed 2007·Granted Dec 14, 2010·2 cites·9 claims
- 2565US7724536B2Circuit deviceSANYO ELECTRIC CO·Filed 2006·Granted May 25, 2010·3 cites·2 claims
- 2664US7808114B2Circuit device and method of manufacturing thereofSANYO ELECTRIC CO·Filed 2006·Granted Oct 5, 2010·2 cites·14 claims
- 2764US6071807AFabrication method of semiconductor device including insulation film with decomposed organic contentSANYO ELECTRIC CO·Filed 1997·Granted Jun 6, 2000·29 cites·12 claims
- 2863US6953712B2Circuit device manufacturing methodKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Oct 11, 2005·9 cites·13 claims
- 2963US6326318B1Process for producing semiconductor devices including an insulating layer with an impuritySANYO ELECTRIC CO·Filed 2000·Granted Dec 4, 2001·9 cites·7 claims
- 3063US5892269ASemiconductor device including an intrusion film layerSANYO ELECTRIC CO·Filed 1997·Granted Apr 6, 1999·26 cites·8 claims
- 3162US7553164B2Circuit device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2006·Granted Jun 30, 2009·2 cites·4 claims
- 3261US7939373B2Manufacturing method for semiconductor device containing stacked semiconductor chipsSANYO ELECTRIC CO·Filed 2008·Granted May 10, 2011·1 cites·12 claims
- 3361US7030033B2Method for manufacturing circuit devicesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Apr 18, 2006·9 cites·25 claims
- 3460US10553676B2Compound semiconductor device, method for producing same, and resin-sealed type semiconductor devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Feb 4, 2020·0 cites·28 claims
- 3560US6214749B1Process for producing semiconductor devicesSANYO ELECTRIC CO·Filed 1997·Granted Apr 10, 2001·25 cites·14 claims
- 3659US7854062B2Method for manufacturing circuit deviceSANYO ELECTRIC CO·Filed 2009·Granted Dec 21, 2010·1 cites·9 claims
- 3757US11107915B2Semiconductor devicePANASONIC SEMICONDUCTOR SOLUTIONS CO LTD·Filed 2020·Granted Aug 31, 2021·0 cites·14 claims
- 3857US10224397B2Compound semiconductor device, method for producing same, and resin-sealed type semiconductor devicePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 5, 2019·0 cites·28 claims
- 3957US7565738B2Method for manufacturing circuit deviceSANYO ELECTRIC CO·Filed 2005·Granted Jul 28, 2009·1 cites·9 claims
- 4057US6949470B2Method for manufacturing circuit devicesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Sep 27, 2005·7 cites·9 claims
- 4157US6268657B1Semiconductor devices and an insulating layer with an impuritySANYO ELECTRIC CO·Filed 1997·Granted Jul 31, 2001·19 cites·18 claims
- 4256US2009149034A1Semiconductor module and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2008·Application pending·0 cites
- 4355US6177343B1Process for producing semiconductor devices including an insulating layer with an impuritySANYO ELECTRIC CO·Filed 1999·Granted Jan 23, 2001·18 cites·7 claims
- 4452US9865679B2Compound semiconductor device, method for producing same, and resin-sealed type semiconductor devicePANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 9, 2018·0 cites·12 claims
- 4551US8344522B2Solder structure, method for forming the solder structure, and semiconductor module including the solder structureSANYO ELECTRIC CO·Filed 2009·Granted Jan 1, 2013·0 cites·4 claims
- 4650US8183090B2Methods for manufacturing device mounting board and circuit substrateNAKASATO MAYUMI·Filed 2010·Granted May 22, 2012·0 cites·8 claims
- 4750US6917110B2Semiconductor device comprising an interconnect structure with a modified low dielectric insulation layerSANYO ELECTRIC CO·Filed 2002·Granted Jul 12, 2005·4 cites·9 claims
- 4849US2011263121A1Manufacturing method for semiconductor device containing stacked semiconductor chipsSANYO ELECTRIC CO·Filed 2011·Application pending·0 cites
- 4948US6825132B1Manufacturing method of semiconductor device including an insulation film on a conductive layerSANYO ELECTRIC CO·Filed 1999·Granted Nov 30, 2004·13 cites·10 claims
- 5048US6617240B2Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2000·Granted Sep 9, 2003·3 cites·14 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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