Inventor · disambiguated record
Hisatane Komori
Also filed as: KOMORI HISATANE
11 granted patents·1 pending application·208 citations·filing 1996–2019
88Inventor score
Top patents by PatentIndex Score
12 records- 0191US6383835B1IC package having a conductive material at least partially filling a recessCANON KK·Filed 1996·Granted May 7, 2002·162 cites·33 claims
- 0290US8279336B2Solid-state image pickup deviceTSUDUKI KOJI·Filed 2010·Granted Oct 2, 2012·23 cites·20 claims
- 0385US9774769B2Mounted electronic component including connection portionsCANON KK·Filed 2015·Granted Sep 26, 2017·5 cites·20 claims
- 0484US10831235B2Electronic module and imaging systemCANON KK·Filed 2019·Granted Nov 10, 2020·4 cites·20 claims
- 0584US9155212B2Electronic component, mounting member, electronic apparatus, and their manufacturing methodsCANON KK·Filed 2013·Granted Oct 6, 2015·7 cites·20 claims
- 0678US9220172B2Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatusCANON KK·Filed 2013·Granted Dec 22, 2015·5 cites·20 claims
- 0776US10735673B2Imaging device module, imaging system, imaging device package, and manufacturing methodCANON KK·Filed 2019·Granted Aug 4, 2020·2 cites·15 claims
- 0843US9253922B2Electronic component and electronic apparatusCANON KK·Filed 2013·Granted Feb 2, 2016·0 cites·21 claims
- 0941US8241951B2Method of manufacturing solid-state image pickup device and solid-state image pickup deviceKOMORI HISATANE·Filed 2009·Granted Aug 14, 2012·0 cites·26 claims
- 1040US8698938B2Solid-state imaging apparatus, method of manufacturing same, and cameraTSUDUKI KOJI·Filed 2012·Granted Apr 15, 2014·0 cites·11 claims
- 1138US9815133B2Method for producing a moduleCANON KK·Filed 2015·Granted Nov 14, 2017·0 cites·20 claims
- 1233US2002053742A1IC package and its assembly methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →