Inventor · disambiguated record
Masaya Kawano
Also filed as: KAWANO MASAYA
75 granted patents·19 pending applications·677 citations·filing 1994–2025
99Inventor score
Files withNEC ELECTRONICS CORP27RENESAS ELECTRONICS CORP22KAWANO MASAYA10NEC CORP10MITSUBISHI HEAVY IND LTD8
Top patents by PatentIndex Score
94 records- 0198US7541677B2Semiconductor device comprising through-electrode interconnectNEC ELECTRONICS CORP·Filed 2005·Granted Jun 2, 2009·53 cites·21 claims
- 0296US9406602B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 2, 2016·9 cites·10 claims
- 0396US8354340B2Electronic device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2007·Granted Jan 15, 2013·23 cites·21 claims
- 0495US10224318B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 5, 2019·6 cites·16 claims
- 0595US8633591B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Jan 21, 2014·10 cites·10 claims
- 0695US8058165B2Semiconductor device and method of manufacturing the sameKAWANO MASAYA·Filed 2010·Granted Nov 15, 2011·17 cites·8 claims
- 0795US7800233B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Sep 21, 2010·32 cites·17 claims
- 0894US7807567B2Semiconductor device with interconnection structure for reducing stress migrationNEC ELECTRONICS CORP·Filed 2007·Granted Oct 5, 2010·29 cites·3 claims
- 0994US7598117B2Method for manufacturing semiconductor module using interconnection structureNEC ELECTRONICS CORP·Filed 2006·Granted Oct 6, 2009·26 cites·19 claims
- 1093US8975750B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 10, 2015·7 cites·18 claims
- 1193US8823174B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 2, 2014·7 cites·5 claims
- 1293US7633167B2Semiconductor device and method for manufacturing sameNEC ELECTRONICS CORP·Filed 2006·Granted Dec 15, 2009·21 cites·18 claims
- 1392US7528068B2Method for manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted May 5, 2009·26 cites·20 claims
- 1490US8395269B2Method of stacking semiconductor chips including forming an interconnect member and a through electrodeKAWANO MASAYA·Filed 2010·Granted Mar 12, 2013·10 cites·25 claims
- 1590US8072073B2Semiconductor device and method of manufacturing sameKIKUCHI KATSUMI·Filed 2008·Granted Dec 6, 2011·23 cites·19 claims
- 1690US7247935B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Jul 24, 2007·18 cites·15 claims
- 1789US9847325B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 19, 2017·3 cites·16 claims
- 1889US8035231B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Oct 11, 2011·17 cites·4 claims
- 1989US7928001B2Electronic device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2007·Granted Apr 19, 2011·14 cites·8 claims
- 2086US7892973B2Method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Feb 22, 2011·9 cites·12 claims
- 2186US7145247B2Offset-bonded, multi-chip semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Dec 5, 2006·42 cites·24 claims
- 2285US8035217B2Semiconductor device and method for manufacturing sameNEC CORP·Filed 2008·Granted Oct 11, 2011·9 cites·20 claims
- 2384US8304915B2Semiconductor device and method for manufacturing the sameMORI KENTARO·Filed 2009·Granted Nov 6, 2012·12 cites·23 claims
- 2481US8830694B2Circuit deviceKAWANO MASAYA·Filed 2011·Granted Sep 9, 2014·4 cites·22 claims
- 2579US7768133B2Semiconductor device and semiconductor module employing thereofNEC ELECTRONICS CORP·Filed 2005·Granted Aug 3, 2010·7 cites·17 claims
- 2679US7538022B2Method of manufacturing electronic circuit deviceNEC ELECTRONICS CORP·Filed 2006·Granted May 26, 2009·8 cites·20 claims
- 2779US7405472B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Jul 29, 2008·7 cites·2 claims
- 2878US8115312B2Semiconductor device having a through electrodeKAWANO MASAYA·Filed 2005·Granted Feb 14, 2012·7 cites·18 claims
- 2977US8114766B1Method for manufacturing semiconductor deviceSOEJIMA KOJI·Filed 2009·Granted Feb 14, 2012·9 cites·17 claims
- 3077US8008191B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 30, 2011·4 cites·13 claims
- 3176US8456020B2Semiconductor package and method of manufacturing the sameKURITA YOICHIRO·Filed 2010·Granted Jun 4, 2013·4 cites·9 claims
- 3276US8102049B2Semiconductor device including through electrode and method of manufacturing the sameTAKAHASHI NOBUAKI·Filed 2007·Granted Jan 24, 2012·6 cites·14 claims
- 3375US8085549B2Circuit deviceKAWANO MASAYA·Filed 2009·Granted Dec 27, 2011·4 cites·16 claims
- 3475US7656046B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Feb 2, 2010·6 cites·20 claims
- 3574US7999401B2Semiconductor device and method of manufacturing sameNEC CORP·Filed 2008·Granted Aug 16, 2011·6 cites·20 claims
- 3673US8022529B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Sep 20, 2011·3 cites·10 claims
- 3773US7033928B2Method of fabricating semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Apr 25, 2006·16 cites·8 claims
- 3871US8143716B2Semiconductor device with plate-shaped componentKAWANO MASAYA·Filed 2005·Granted Mar 27, 2012·5 cites·22 claims
- 3971US7759786B2Electronic circuit chip, and electronic circuit device and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Jul 20, 2010·5 cites·14 claims
- 4070US10879227B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Dec 29, 2020·0 cites·18 claims
- 4170US8739612B2Wear control apparatus and wind turbine blade monitoring system including wind turbine bladeMITSUBISHI HEAVY IND LTD·Filed 2013·Granted Jun 3, 2014·3 cites·8 claims
- 4269US10580763B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Mar 3, 2020·0 cites·8 claims
- 4367US8552570B2Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor deviceKIKUCHI KATSUMI·Filed 2009·Granted Oct 8, 2013·3 cites·13 claims
- 4467US8536691B2Semiconductor device and method for manufacturing the sameKIKUCHI KATSUMI·Filed 2007·Granted Sep 17, 2013·4 cites·25 claims
- 4567US8456019B2Semiconductor deviceKAWANO MASAYA·Filed 2012·Granted Jun 4, 2013·1 cites·16 claims
- 4667US7262486B2SOI substrate and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2005·Granted Aug 28, 2007·3 cites·12 claims
- 4767US6048632ASelf-biasing, non-magnetic, giant magnetoresistance sensorNEC RESEARCH INST·Filed 1997·Granted Apr 11, 2000·19 cites·32 claims
- 4866US8183685B2Semiconductor deviceKAWANO MASAYA·Filed 2011·Granted May 22, 2012·1 cites·18 claims
- 4966US7927999B2Method of forming metal interconnect layers for flip chip deviceRENESAS ELECTRONICS CORP·Filed 2006·Granted Apr 19, 2011·2 cites·5 claims
- 5065US11795997B2Fluid film bearingMITSUBISHI HEAVY IND LTD·Filed 2022·Granted Oct 24, 2023·0 cites·4 claims
Showing the top 50 of 94 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →