Inventor · disambiguated record
Mike Brooks
Also filed as: BROOKS MIKE · BROOKS MIKE T
62 granted patents·4 pending applications·4,556 citations·filing 1994–2020
99Inventor score
Files withMICRON TECHNOLOGY INC29ROCKY SHOES & BOOTS INC23ROCKY SHOES AND BOOTS INC6IBM3INTERMEC IP CORP1
Top patents by PatentIndex Score
66 records- 0199US6614104B2Stackable semiconductor package having conductive layer and insulating layersMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 2, 2003·220 cites·30 claims
- 0299US6501165B1Stackable semiconductor package having conductive layer and insulating layers and method of fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 31, 2002·249 cites·32 claims
- 0399US6097087ASemiconductor package including flex circuit, interconnects and dense array external contactsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 1, 2000·539 cites·6 claims
- 0499US6020629AStacked semiconductor package and method of fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 1, 2000·621 cites·23 claims
- 0598US6465877B1Semiconductor package including flex circuit, interconnects and dense array external contactsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 15, 2002·166 cites·28 claims
- 0698US6451624B1Stackable semiconductor package having conductive layer and insulating layers and method of fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 17, 2002·220 cites·18 claims
- 0798US6368896B2Method of wafer level chip scale packagingMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 9, 2002·267 cites·17 claims
- 0898US5990566AHigh density semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 23, 1999·317 cites·22 claims
- 0997USD367354SShoe upperROCKY SHOES & BOOTS INC·Filed 1994·Granted Feb 27, 1996·70 cites·1 claims
- 1096US6740546B2Packaged microelectronic devices and methods for assembling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2002·Granted May 25, 2004·93 cites·48 claims
- 1196US6049125ASemiconductor package with heat sink and method of fabricationMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 11, 2000·185 cites·36 claims
- 1295US6326242B1Semiconductor package with heat sink and method of fabricationMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 4, 2001·157 cites·34 claims
- 1395USD368361SShoe upperROCKY SHOES & BOOTS INC·Filed 1994·Granted Apr 2, 1996·52 cites·1 claims
- 1494US6740960B1Semiconductor package including flex circuit, interconnects and dense array external contactsMICRON TECHNOLOGY INC·Filed 2002·Granted May 25, 2004·68 cites·17 claims
- 1594USD380598SShoe upperROCKY SHOES & BOOTS INC·Filed 1996·Granted Jul 8, 1997·53 cites·1 claims
- 1692US6271056B1Stacked semiconductor package and method of fabricationMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 7, 2001·120 cites·21 claims
- 1792USD401746SShoe soleROCKY SHOES & BOOTS INC·Filed 1996·Granted Dec 1, 1998·42 cites·1 claims
- 1892USD380599SShoe upperROCKY SHOES & BOOTS INC·Filed 1996·Granted Jul 8, 1997·43 cites·1 claims
- 1992USD380597SShoe upperROCKY SHOES & BOOTS INC·Filed 1996·Granted Jul 8, 1997·46 cites·1 claims
- 2091US6924550B2Packaged microelectronic devices and methods for assembling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 2, 2005·54 cites·26 claims
- 2191US6891248B2Semiconductor component with on board capacitorMICRON TECHNOLOGY INC·Filed 2002·Granted May 10, 2005·50 cites·34 claims
- 2290US6911355B2Semiconductor package having flex circuit with external contactsMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 28, 2005·38 cites·25 claims
- 2390USD368797SShoe upperROCKY SHOES & BOOTS INC·Filed 1995·Granted Apr 16, 1996·39 cites·1 claims
- 2490USD367165SShoe upperROCKY SHOES & BOOTS INC·Filed 1994·Granted Feb 20, 1996·34 cites·1 claims
- 2589USD385992SShoe upperROCKY SHOES AND BOOTS INC·Filed 1996·Granted Nov 11, 1997·36 cites·1 claims
- 2687USD385991SShoe upperROCKY SHOES AND BOOTS INC·Filed 1996·Granted Nov 11, 1997·33 cites·1 claims
- 2787USD369019SShoe upperROCKY SHOES & BOOTS INC·Filed 1995·Granted Apr 23, 1996·33 cites·1 claims
- 2886USD407196SShoe upperROCKY SHOES & BOOTS INC·Filed 1997·Granted Mar 30, 1999·30 cites·1 claims
- 2984US5691649ACarrier having slide connectors for testing unpackaged semiconductor diceMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 25, 1997·65 cites·14 claims
- 3084USD386294SShoe upperROCKY SHOES AND BOOTS INC·Filed 1996·Granted Nov 18, 1997·28 cites·1 claims
- 3183US10574758B2Server connection capacity managementIBM·Filed 2017·Granted Feb 25, 2020·3 cites·7 claims
- 3283USD384195SShoe upperROCKY SHOES AND BOOTS INC·Filed 1996·Granted Sep 30, 1997·26 cites·1 claims
- 3382US10616346B2Server connection capacity managementIBM·Filed 2017·Granted Apr 7, 2020·3 cites·13 claims
- 3482US7002248B2Semiconductor components having multiple on board capacitorsMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 21, 2006·24 cites·36 claims
- 3582US6618162B1Apparatus and method to configure a device, such as a printer, over a networkINTERMEC IP CORP·Filed 1999·Granted Sep 9, 2003·76 cites·63 claims
- 3682US5770479ABonding support for leads-over-chip processMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 23, 1998·57 cites·24 claims
- 3782USD380891SShoe upperROCKY SHOES & BOOTS INC·Filed 1996·Granted Jul 15, 1997·25 cites·1 claims
- 3882USD376684SShoe upperROCKY SHOES & BOOTS INC·Filed 1995·Granted Dec 24, 1996·25 cites·1 claims
- 3981USD400699SShoe upperROCKY SHOES & BOOTS INC·Filed 1997·Granted Nov 10, 1998·23 cites·1 claims
- 4080USD369018SShoe upperROCKY SHOES & BOOTS INC·Filed 1995·Granted Apr 23, 1996·23 cites·1 claims
- 4179US6975037B2Semiconductor package having flex circuit with external contactsMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 13, 2005·18 cites·25 claims
- 4279US6294824B1Bonding support for leads-over-chip processMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 25, 2001·45 cites·21 claims
- 4379USD386293SShoe upperROCKY SHOES AND BOOTS INC·Filed 1996·Granted Nov 18, 1997·22 cites·1 claims
- 4478US11070625B2Server connection capacity managementIBM·Filed 2020·Granted Jul 20, 2021·1 cites·20 claims
- 4577USD386292SShoe upperROCKY SHOES AND BOOTS INC·Filed 1996·Granted Nov 18, 1997·20 cites·1 claims
- 4672US6060893ACarrier having slide connectors for testing unpackaged semiconductor diceMICRON TECHNOLOGY INC·Filed 1997·Granted May 9, 2000·35 cites·24 claims
- 4771US6539646B2Footwear sole with integral display elementROCKY SHOES & BOOTS INC·Filed 2001·Granted Apr 1, 2003·27 cites·15 claims
- 4870US7041537B2Method for fabricating semiconductor component with on board capacitorMICRON TECHNOLOGY INC·Filed 2003·Granted May 9, 2006·12 cites·23 claims
- 4969USD401401SShoe upperROCKY SHOES & BOOTS INC·Filed 1997·Granted Nov 24, 1998·14 cites·1 claims
- 5065US7151013B2Semiconductor package having exposed heat dissipating surface and method of fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 19, 2006·10 cites·6 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →