Inventor · disambiguated record
Kazuto Tsuji
Also filed as: TSUJI KAZUTO
51 granted patents·3 pending applications·3,814 citations·filing 1986–2008
99Inventor score
Top patents by PatentIndex Score
54 records- 0199US6072239ADevice having resin package with projectionsFUJITSU LTD·Filed 1996·Granted Jun 6, 2000·241 cites·14 claims
- 0299US5625222ASemiconductor device in a resin package housed in a frame having high thermal conductivityFUJITSU LTD·Filed 1994·Granted Apr 29, 1997·1k cites·8 claims
- 0398US5656550AMethod of producing a semicondutor device having a lead portion with outer connecting terminalFUJITSU LTD·Filed 1996·Granted Aug 12, 1997·366 cites·24 claims
- 0496US6573121B2Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 2001·Granted Jun 3, 2003·126 cites·15 claims
- 0596US6376921B1Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 1998·Granted Apr 23, 2002·120 cites·11 claims
- 0694US6025650ASemiconductor device including a frame terminalFUJITSU LTD·Filed 1997·Granted Feb 15, 2000·220 cites·15 claims
- 0793US6159770AMethod and apparatus for fabricating semiconductor deviceFUJITSU LTD·Filed 1998·Granted Dec 12, 2000·212 cites·9 claims
- 0892US6255740B1Semiconductor device having a lead portion with outer connecting terminalsFUJITSU LTD·Filed 1997·Granted Jul 3, 2001·122 cites·7 claims
- 0992US5451815ASemiconductor device with surface mount package adapted for vertical mountingFUJITSU LTD·Filed 1994·Granted Sep 19, 1995·134 cites·21 claims
- 1090US5293072ASemiconductor device having spherical terminals attached to the lead frame embedded within the package bodyFUJITSU LTD·Filed 1993·Granted Mar 8, 1994·97 cites·6 claims
- 1186US5521432ASemiconductor device having improved leads comprising palladium plated nickelFUJITSU LTD·Filed 1994·Granted May 28, 1996·84 cites·32 claims
- 1284US6798031B2Semiconductor device and method for making the sameFUJITSU LTD·Filed 2002·Granted Sep 28, 2004·39 cites·42 claims
- 1384US5930603AMethod for producing a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Jul 27, 1999·77 cites·10 claims
- 1483US6191494B1Semiconductor device and method of producing the sameFUJITSU LTD·Filed 1999·Granted Feb 20, 2001·99 cites·8 claims
- 1583US5804468AProcess for manufacturing a packaged semiconductor having a divided leadframe stageFUJITSU LTD·Filed 1995·Granted Sep 8, 1998·65 cites·4 claims
- 1683US5497032ASemiconductor device and lead frame thereforeFUJITSU LTD·Filed 1994·Granted Mar 5, 1996·65 cites·45 claims
- 1781US5842628AWire bonding method, semiconductor device, capillary for wire bonding and ball bump forming methodFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·56 cites·8 claims
- 1878US7193320B2Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2003·Granted Mar 20, 2007·24 cites·12 claims
- 1977US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 2077US5703398ASemiconductor integrated circuit device and method of producing the semiconductor integrated circuit deviceFUJITSU LTD·Filed 1996·Granted Dec 30, 1997·51 cites·15 claims
- 2177US5569625AProcess for manufacturing a plural stacked leadframe semiconductor deviceFUJITSU LTD·Filed 1994·Granted Oct 29, 1996·47 cites·8 claims
- 2274US7476811B2Semiconductor device and manufacturing method thereforFUJITSU LTD·Filed 2005·Granted Jan 13, 2009·6 cites·7 claims
- 2374US6495773B1Wire bonded device with ball-shaped bondsFUJITSU LTD·Filed 1998·Granted Dec 17, 2002·38 cites·4 claims
- 2474US5786985ASemiconductor device and semiconductor device unitFUJITSU LTD·Filed 1996·Granted Jul 28, 1998·47 cites·22 claims
- 2570US6069408ASemiconductor device and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 1999·Granted May 30, 2000·32 cites·6 claims
- 2670US5750421ASemiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceFUJITSU LTD·Filed 1997·Granted May 12, 1998·27 cites·4 claims
- 2770US5475259ASemiconductor device and carrier for carrying semiconductor deviceFUJITSU LTD·Filed 1992·Granted Dec 12, 1995·29 cites·24 claims
- 2868US6472744B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 1998·Granted Oct 29, 2002·31 cites·17 claims
- 2968US5666064ASemiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceFUJITSU LTD·Filed 1995·Granted Sep 9, 1997·25 cites·7 claims
- 3067US5767527ASemiconductor device suitable for testingFUJITSU LTD·Filed 1995·Granted Jun 16, 1998·31 cites·18 claims
- 3166US7361980B2Semiconductor deviceFUJITSU LTD·Filed 2005·Granted Apr 22, 2008·3 cites·9 claims
- 3262US5403776AProcess of using a jig to align and mount terminal conductors to a semiconductor plastic packageFUJITSU LTD·Filed 1993·Granted Apr 4, 1995·27 cites·6 claims
- 3361US5891758ASemiconductor device and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 1997·Granted Apr 6, 1999·23 cites·16 claims
- 3461US5684675ASemiconductor device unit having holderFUJITSU LTD·Filed 1994·Granted Nov 4, 1997·30 cites·23 claims
- 3559US5904506ASemiconductor device suitable for testingFUJITSU LTD·Filed 1998·Granted May 18, 1999·21 cites·4 claims
- 3658US5574310ASemiconductor package for surface mounting with reinforcing members on support legsFUJITSU LTD·Filed 1995·Granted Nov 12, 1996·21 cites·14 claims
- 3756US6856017B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 1999·Granted Feb 15, 2005·13 cites·19 claims
- 3855US7923835B2Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturingFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Apr 12, 2011·1 cites·4 claims
- 3954US5654243AProcess for fabricating a semiconductor device in a resin package housed in a frame having high conductivityFUJITSU LTD·Filed 1996·Granted Aug 5, 1997·16 cites·2 claims
- 4053US5440170ASemiconductor device having a die pad with rounded edges and its manufacturing methodFUJITSU LTD·Filed 1991·Granted Aug 8, 1995·20 cites·6 claims
- 4151US5399804ASemiconductor device and method of producing the sameFUJITSU LTD·Filed 1993·Granted Mar 21, 1995·16 cites·15 claims
- 4250US5637923ASemiconductor device, carrier for carrying semiconductor deviceFUJITSU LTD·Filed 1995·Granted Jun 10, 1997·11 cites·3 claims
- 4347US7144754B2Device having resin package and method of producing the sameFUJITSU LTD·Filed 2004·Granted Dec 5, 2006·1 cites·7 claims
- 4447US5808357ASemiconductor device having resin encapsulated package structureFUJITSU LTD·Filed 1995·Granted Sep 15, 1998·11 cites·14 claims
- 4547US2007114642A1Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2007·Application pending·0 cites
- 4645US5736428AProcess for manufacturing a semiconductor device having a stepped encapsulated packageFUJITSU LTD·Filed 1997·Granted Apr 7, 1998·8 cites·8 claims
- 4745US2007221978A1Semiconductor deviceFUJITSU LTD·Filed 2007·Application pending·0 cites
- 4844US4724280APackage for integrated circuitFUJITSU LTD·Filed 1986·Granted Feb 9, 1988·12 cites·2 claims
- 4943US5861669ASemiconductor package for surface mountingFUJITSU LTD·Filed 1995·Granted Jan 19, 1999·10 cites·38 claims
- 5041US6271583B1Semiconductor device having resin encapsulated package structureFUJITSU LTD·Filed 1998·Granted Aug 7, 2001·7 cites·10 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →