Inventor · disambiguated record
Masanori Yoshimoto
Also filed as: YOSHIMOTO MASANORI
21 granted patents·2 pending applications·510 citations·filing 1992–2024
95Inventor score
Top patents by PatentIndex Score
23 records- 0192US5920117ASemiconductor device and method of forming the deviceFUJITSU LTD·Filed 1997·Granted Jul 6, 1999·135 cites·12 claims
- 0283US5637915ASemiconductor device affixed to an upper and a lower leadframeFUJITSU LTD·Filed 1996·Granted Jun 10, 1997·69 cites·14 claims
- 0380US11097778B2Vehicle rear structureTOYOTA MOTOR CO LTD·Filed 2019·Granted Aug 24, 2021·3 cites·12 claims
- 0480US5409866AProcess for manufacturing a semiconductor device affixed to an upper and a lower leadframeFUJITSU LTD·Filed 1992·Granted Apr 25, 1995·60 cites·24 claims
- 0575US12428074B2Vehicle front portion structureTOYOTA MOTOR CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·2 claims
- 0674US5786985ASemiconductor device and semiconductor device unitFUJITSU LTD·Filed 1996·Granted Jul 28, 1998·47 cites·22 claims
- 0771US5444025AProcess for encapsulating a semiconductor package having a heat sink using a jigFUJITSU LTD·Filed 1994·Granted Aug 22, 1995·39 cites·12 claims
- 0867US5305179ASurface-mounting type semiconductor package having an improved efficiency for heat dissipationFUJITSU LTD·Filed 1992·Granted Apr 19, 1994·39 cites·16 claims
- 0965US11104382B2Vehicle rear structureTOYOTA MOTOR CO LTD·Filed 2019·Granted Aug 31, 2021·2 cites·12 claims
- 1063US11377152B2Vehicle rear portion structureTOYOTA MOTOR CO LTD·Filed 2019·Granted Jul 5, 2022·1 cites·4 claims
- 1162US2025162651A1Vehicle front section structureTOYOTA MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1262US2025162654A1Vehicle front section structureTOYOTA MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1361US5684675ASemiconductor device unit having holderFUJITSU LTD·Filed 1994·Granted Nov 4, 1997·30 cites·23 claims
- 1458US5574310ASemiconductor package for surface mounting with reinforcing members on support legsFUJITSU LTD·Filed 1995·Granted Nov 12, 1996·21 cites·14 claims
- 1557US5446317ASingle in-line package for surface mountingFUJITSU LTD·Filed 1993·Granted Aug 29, 1995·22 cites·10 claims
- 1652US8610681B2Information processing apparatus and information processing methodYOSHIMOTO MASANORI·Filed 2011·Granted Dec 17, 2013·1 cites·16 claims
- 1745US5728601AProcess for manufacturing a single in-line package for surface mountingFUJITSU LTD·Filed 1995·Granted Mar 17, 1998·11 cites·12 claims
- 1845US5659200ASemiconductor device having radiator structureFUJITSU LTD·Filed 1995·Granted Aug 19, 1997·11 cites·12 claims
- 1943US5861669ASemiconductor package for surface mountingFUJITSU LTD·Filed 1995·Granted Jan 19, 1999·10 cites·38 claims
- 2041US10518809B2Vehicle rear structureTOYOTA MOTOR CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·5 claims
- 2133US5293064ALead frame and method of manufacturing a semiconductor deviceFUJITSU LTD·Filed 1992·Granted Mar 8, 1994·6 cites·16 claims
- 2231US5831332ASemiconductor package for surface mountingFUJITSU LTD·Filed 1996·Granted Nov 3, 1998·1 cites·21 claims
- 2328US5343615ASemiconductor device and a process for making same having improved leadsFUJITSU LTD·Filed 1992·Granted Sep 6, 1994·2 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →