Inventor · disambiguated record
Tsunekazu Hashimoto
Also filed as: HASHIMOTO TSUNEKAZU
3 granted patents·100 citations·filing 1990–2002
75Inventor score
Top patents by PatentIndex Score
3 records- 0180US6063646AMethod for production of semiconductor packageJAPAN REC CO LTD·Filed 1998·Granted May 16, 2000·63 cites·4 claims
- 0262US5232651AMethod of sealing electric parts mounted on electric wiring board with resin compositionJAPAN REC CO LTD·Filed 1990·Granted Aug 3, 1993·28 cites·4 claims
- 0358USRE38961EMethod for production of semiconductor packageSANYU REC CO LTD·Filed 2002·Granted Jan 31, 2006·9 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Tsunekazu Hashimoto files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →