Inventor · disambiguated record
Thomas E. Lombardi
Also filed as: LOMBARDI THOMAS · LOMBARDI THOMAS E · LOMBARDI THOMAS EDWARD
35 granted patents·2 pending applications·253 citations·filing 1993–2021
96Inventor score
Top patents by PatentIndex Score
37 records- 0190US5480503AProcess for producing circuitized layers and multilayer ceramic sub-laminates and composites thereofIBM·Filed 1993·Granted Jan 2, 1996·127 cites·11 claims
- 0286US11228124B1Connecting a component to a substrate by adhesion to an oxidized solder surfaceIBM·Filed 2021·Granted Jan 18, 2022·1 cites·14 claims
- 0386US9798088B2Barrier structures for underfill blockout regionsGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 24, 2017·5 cites·15 claims
- 0482US6518674B2Temporary attach article and method for temporary attach of devices to a substrateIBM·Filed 2001·Granted Feb 11, 2003·23 cites·7 claims
- 0580US9627784B1Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2015·Granted Apr 18, 2017·2 cites·10 claims
- 0680US9093563B2Electronic module assembly with patterned adhesive arrayIBM·Filed 2013·Granted Jul 28, 2015·4 cites·21 claims
- 0779US9048245B2Method for shaping a laminate substrateBLACKSHEAR EDMUND·Filed 2012·Granted Jun 2, 2015·5 cites·20 claims
- 0876US6762119B2Method of preventing solder wetting in an optical device using diffusion of CrINTERNAT BUSSINESS MACHINES CO·Filed 2001·Granted Jul 13, 2004·23 cites·18 claims
- 0976US6528352B1Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applicationsIBM·Filed 2001·Granted Mar 4, 2003·20 cites·20 claims
- 1070US10014273B2Fixture to constrain laminate and method of assemblyIBM·Filed 2016·Granted Jul 3, 2018·1 cites·20 claims
- 1170US9059240B2Fixture for shaping a laminate substrateBLACKSHEAR EDMUND D·Filed 2012·Granted Jun 16, 2015·3 cites·25 claims
- 1266US10368441B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2018·Granted Jul 30, 2019·1 cites·20 claims
- 1364US9543253B2Method for shaping a laminate substrateGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 10, 2017·1 cites·20 claims
- 1464US8304290B2Overcoming laminate warpage and misalignment in flip-chip packagesGRAF RICHARD S·Filed 2009·Granted Nov 6, 2012·3 cites·25 claims
- 1563US8129230B2Underfill method and chip packageGAYNES MICHAEL A·Filed 2009·Granted Mar 6, 2012·2 cites·13 claims
- 1659US9974179B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2017·Granted May 15, 2018·0 cites·6 claims
- 1757US9455234B2Fixture to constrain laminate and method of assemblyIBM·Filed 2014·Granted Sep 27, 2016·0 cites·17 claims
- 1856US9293439B2Electronic module assembly with patterned adhesive arrayGLOBALFOUNDRIES INC·Filed 2014·Granted Mar 22, 2016·0 cites·7 claims
- 1954US10750615B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 2053US11694992B2Near tier decoupling capacitorsIBM·Filed 2021·Granted Jul 4, 2023·0 cites·14 claims
- 2152US12183702B2Electronic package with varying interconnectsIBM·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 2250US8492910B2Underfill method and chip packageGAYNES MICHAEL A·Filed 2012·Granted Jul 23, 2013·0 cites·4 claims
- 2349US8759151B2Fixture to constrain laminate and method of assemblyLOMBARDI THOMAS E·Filed 2012·Granted Jun 24, 2014·0 cites·14 claims
- 2448US11152226B2Structure with controlled capillary coverageIBM·Filed 2019·Granted Oct 19, 2021·0 cites·24 claims
- 2547US10985129B2Mitigating cracking within integrated circuit (IC) device carrierIBM·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 2646US8188597B2Fixture to constrain laminate and method of assemblyLOMBARDI THOMAS E·Filed 2010·Granted May 29, 2012·0 cites·16 claims
- 2745US10832987B2Managing thermal warpage of a laminateIBM·Filed 2018·Granted Nov 10, 2020·0 cites·16 claims
- 2845US9433105B2Method of fabricating printed circuit boardsGRAF RICHARD STEPHEN·Filed 2009·Granted Aug 30, 2016·0 cites·13 claims
- 2943US5643818ARemoval of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chipIBM·Filed 1996·Granted Jul 1, 1997·11 cites·15 claims
- 3041US8367543B2Structure and method to improve current-carrying capabilities of C4 jointsIBM·Filed 2006·Granted Feb 5, 2013·0 cites·9 claims
- 3140US2007099346A1Surface treatments for underfill controlIBM·Filed 2005·Application pending·0 cites
- 3239US9673177B1Selectively soluble standoffs for chip joiningIBM·Filed 2015·Granted Jun 6, 2017·0 cites·19 claims
- 3338US5795217AStressed burnisherIBM·Filed 1995·Granted Aug 18, 1998·8 cites·21 claims
- 3437US5489465AEdge seal technology for low dielectric/porous substrate processingIBM·Filed 1994·Granted Feb 6, 1996·6 cites·13 claims
- 3537US2018104758A1PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEANIBM·Filed 2016·Application pending·0 cites
- 3635US6376054B1Surface metallization structure for multiple chip test and burn-inIBM·Filed 1999·Granted Apr 23, 2002·5 cites·22 claims
- 3732US6303400B1Temporary attach article and method for temporary attach of devices to a substrateIBM·Filed 1999·Granted Oct 16, 2001·2 cites·18 claims
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