Inventor · disambiguated record
Paul V. Miller
Also filed as: MILLER PAUL · MILLER PAUL V
8 granted patents·2 pending applications·200 citations·filing 1998–2011
88Inventor score
Files withAPPLIED MATERIALS INC5APPLIED MATREIALS INC1BENVEGNU DOMINIC J1CHARAK CRAIG1MICROSOFT CORP1
Top patents by PatentIndex Score
10 records- 0191US8125654B2Methods and apparatus for measuring substrate edge thickness during polishingBENVEGNU DOMINIC J·Filed 2009·Granted Feb 28, 2012·19 cites·16 claims
- 0289US6325536B1Integrated wafer temperature sensorsSENSARRAY CORP·Filed 1998·Granted Dec 4, 2001·108 cites·41 claims
- 0388US7208325B2Refreshing wafers having low-k dielectric materialsAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·13 cites·7 claims
- 0481US7402520B2Edge removal of silicon-on-insulator transfer waferAPPLIED MATERIALS INC·Filed 2004·Granted Jul 22, 2008·23 cites·15 claims
- 0580US8001101B2Presenting instant answers to internet queriesMICROSOFT CORP·Filed 2008·Granted Aug 16, 2011·13 cites·18 claims
- 0677US6954711B2Test substrate reclamation method and apparatusAPPLIED MATERIALS INC·Filed 2003·Granted Oct 11, 2005·20 cites·38 claims
- 0775US7951718B2Edge removal of silicon-on-insulator transfer waferAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·4 cites·20 claims
- 0850US2011295710A1Business development tool and tom$core scoring modelCHARAK CRAIG·Filed 2011·Application pending·0 cites
- 0946US7695982B2Refurbishing a wafer having a low-k dielectric layerAPPLIED MATREIALS INC·Filed 2007·Granted Apr 13, 2010·0 cites·22 claims
- 1045US2008293329A1Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profileAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →