Inventor · disambiguated record
Richard J. Koba
Also filed as: KOBA RICHARD · KOBA RICHARD J
10 granted patents·3 pending applications·174 citations·filing 1989–2023
87Inventor score
Top patents by PatentIndex Score
13 records- 0187US5087434ASynthesis of diamond powders in the gas phasePENNSYLVANIA RES CORP·Filed 1989·Granted Feb 11, 1992·66 cites·8 claims
- 0285US7157744B2Surface mount package for a high power light emitting diodeMA COM INC·Filed 2003·Granted Jan 2, 2007·60 cites·13 claims
- 0360US5043773AWafer base for silicon carbide semiconductor devices, incorporating alloy substratesADVANCED TECH MATERIALS·Filed 1990·Granted Aug 27, 1991·31 cites·9 claims
- 0456US10896812B2Sputtering target having RFID informationMATERION CORP·Filed 2018·Granted Jan 19, 2021·0 cites·8 claims
- 0555US2023238770A1Semiconductor package for an edge emitting laser diodeMATERION CORP·Filed 2023·Application pending·0 cites
- 0652US9117793B2Air cavity packages having high thermal conductivity base plates and methods of makingMATERION CORP·Filed 2013·Granted Aug 25, 2015·0 cites·21 claims
- 0751US9035448B2Semiconductor packages having metal composite base platesMATERION CORP·Filed 2013·Granted May 19, 2015·0 cites·32 claims
- 0846US5190890AWafer base for silicon carbide semiconductor devices, incorporating alloy substrates, and method of making the sameADVANCED TECH MATERIALS·Filed 1991·Granted Mar 2, 1993·17 cites·17 claims
- 0944US11046051B2Metal-on-ceramic substratesMATERION CORP·Filed 2016·Granted Jun 29, 2021·0 cites·20 claims
- 1040US11227806B2Air cavity package using high temperature silicone adhesiveMATERION CORP·Filed 2017·Granted Jan 18, 2022·0 cites·19 claims
- 1140US10163743B2Copper flanged air cavity packages for high frequency devicesMATERION CORP·Filed 2017·Granted Dec 25, 2018·0 cites·17 claims
- 1233US2016059535A1Conductive bond foilsMATERION CORP·Filed 2015·Application pending·0 cites
- 1330US2017069560A1Air cavity packageMATERION CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →