Inventor · disambiguated record
Yasuhiro Yamakoshi
Also filed as: YAMAKOSHI YASUHIRO
26 granted patents·6 pending applications·284 citations·filing 1993–2021
96Inventor score
Files withJX NIPPON MINING & METALS CORP6NIPPON MINING CO6YAMAKOSHI YASUHIRO5JAPAN ENERGY CORP4OKABE TAKEO3
Top patents by PatentIndex Score
32 records- 0192US7618505B2Target of high-purity nickel or nickel alloy and its producing methodNIPPON MINING CO·Filed 2006·Granted Nov 17, 2009·11 cites·4 claims
- 0290US6858116B2Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particlesNIKKO MATERIALS CO LTD·Filed 2001·Granted Feb 22, 2005·41 cites·19 claims
- 0386US5460793ASilicide targets for sputtering and method of manufacturing the sameJAPAN ENERGY CORP·Filed 1994·Granted Oct 24, 1995·48 cites·4 claims
- 0484US7605481B2Nickel alloy sputtering target and nickel alloy thin filmNIPPON MINING CO·Filed 2004·Granted Oct 20, 2009·15 cites·20 claims
- 0581US5618397ASilicide targets for sputteringJAPAN ENERGY CORP·Filed 1995·Granted Apr 8, 1997·35 cites·3 claims
- 0680US8114341B2Nickel alloy sputtering target and nickel silicide filmYAMAKOSHI YASUHIRO·Filed 2010·Granted Feb 14, 2012·4 cites·1 claims
- 0778US5464520ASilicide targets for sputtering and method of manufacturing the sameJAPAN ENERGY CORP·Filed 1993·Granted Nov 7, 1995·36 cites·4 claims
- 0877US9725088B2Control system, relay device and control methodRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 8, 2017·3 cites·10 claims
- 0977US6153315ASputtering target and method for manufacturing thereofJAPAN ENERGY CORP·Filed 1998·Granted Nov 28, 2000·44 cites·8 claims
- 1076US7347353B2Method for connecting magnetic substance target to backing plate, and magnetic substance targetNIPPON MINING CO·Filed 2002·Granted Mar 25, 2008·20 cites·15 claims
- 1175US8262816B2Hafnium alloy targetOKABE TAKEO·Filed 2008·Granted Sep 11, 2012·3 cites·2 claims
- 1275US8241438B2Hafnium alloy targetOKABE TAKEO·Filed 2008·Granted Aug 14, 2012·3 cites·2 claims
- 1375US8062440B2Hafnium alloy target and process for producing the sameOKABE TAKEO·Filed 2008·Granted Nov 22, 2011·3 cites·5 claims
- 1475US7740718B2Target of high-purity nickel or nickel alloy and its producing methodNIPPON MINING CO·Filed 2002·Granted Jun 22, 2010·7 cites·12 claims
- 1574US10576968B2Control system, relay device and control methodRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 3, 2020·2 cites·6 claims
- 1671US2018085828A1Sintered compact target and method of producing sintered compactJX NIPPON MINING & METALS CORP·Filed 2017·Application pending·0 cites
- 1767US9051645B2Barrier film for semiconductor wiring, sintered compact sputtering target and method of producing the sputtering targetSENDA SHINICHIRO·Filed 2010·Granted Jun 9, 2015·2 cites·14 claims
- 1865US9677170B2Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the sameYAMAKOSHI YASUHIRO·Filed 2008·Granted Jun 13, 2017·1 cites·14 claims
- 1962US10344373B2Process for producing a target formed of a sintering-resistant material of a high-melting point metal alloy, silicide, carbide, nitride or borideJX NIPPON MINING & METALS CORP·Filed 2016·Granted Jul 9, 2019·0 cites·7 claims
- 2062US7938918B2High-purity Ni-V alloy, target therefrom, high-purity Ni-V alloy thin film and process for producing high-purity Ni-V alloyJX NIPPON MINING & METALS CORP·Filed 2010·Granted May 10, 2011·0 cites·6 claims
- 2162US7459036B2Hafnium alloy target and process for producing the sameNIPPON MINING CO·Filed 2004·Granted Dec 2, 2008·5 cites·2 claims
- 2262US2011017590A1Sintered Compact Target and Method of Producing Sintered CompactJX NIPPON MINING & METALS CORP·Filed 2008·Application pending·0 cites
- 2361US8283051B2Plated product having copper thin film formed thereon by electroless platingITO JUNICHI·Filed 2009·Granted Oct 9, 2012·1 cites·5 claims
- 2460US10984992B2Sputtering targetJX NIPPON MINING & METALS CORP·Filed 2016·Granted Apr 20, 2021·0 cites·17 claims
- 2560US2021237153A1Sintered compact target and method of producing sintered compactJX NIPPON MINING & METALS CORP·Filed 2021·Application pending·0 cites
- 2654US9653270B2Method for connecting magnetic substance target to backing plate, and magnetic substance targetYAMAKOSHI YASUHIRO·Filed 2008·Granted May 16, 2017·0 cites·3 claims
- 2754US9249497B2Ni alloy sputtering target, Ni alloy thin film and Ni silicide filmYAMAKOSHI YASUHIRO·Filed 2011·Granted Feb 2, 2016·0 cites·7 claims
- 2851US8871144B2High-purity Ni-V alloy target therefrom high-purity Ni-V alloy thin film and process for producing high-purity Ni-V alloySHINDO YUICHIRO·Filed 2004·Granted Oct 28, 2014·0 cites·10 claims
- 2948US2007209547A1Barrier Film For Flexible Copper Substrate And Sputtering Target For Forming Barrier FilmNIPPON MINING CO·Filed 2005·Application pending·0 cites
- 3047US2012098131A1Nickel Silicide FilmYAMAKOSHI YASUHIRO·Filed 2012·Application pending·0 cites
- 3146US8318314B2Barrier film for flexible copper substrate and sputtering target for forming barrier filmIRUMATA SHUICHI·Filed 2009·Granted Nov 27, 2012·0 cites·9 claims
- 3245US2006037680A1Nickel alloy sputtering targetNIKKO MATERIALS CO LTD·Filed 2003·Application pending·0 cites
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