Inventor · disambiguated record
Soon-Oh Jung
Also filed as: JUNG SOON O · JUNG SOON OH
7 granted patents·11 pending applications·35 citations·filing 2006–2018
81Inventor score
Top patents by PatentIndex Score
18 records- 0190US7707715B2Method of fabricating multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted May 4, 2010·18 cites·21 claims
- 0281US10306778B2Printed circuit board with dam around cavity and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted May 28, 2019·3 cites·20 claims
- 0376US8445790B2Coreless substrate having filled via pad and method of manufacturing the sameLEE SEOK KYU·Filed 2009·Granted May 21, 2013·8 cites·4 claims
- 0470US7971352B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·5 cites·11 claims
- 0564US9848492B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 19, 2017·1 cites·4 claims
- 0656US2007201214A1Core board comprising nickel layer, multilayer board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 0756US2010024212A1Method of fabricating multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0855US10490619B2Manufacturing method of organic light emitting diode display device with first and second driving voltage linesSAMSUNG DISPLAY CO LTD·Filed 2018·Granted Nov 26, 2019·0 cites·5 claims
- 0955US2013243941A1Method of manufacturing coreless substrate having filled via padSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1051US2011079349A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1150US2011056614A1Manufacturing method of circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1249US2010291488A1Manufacturing method for multilayer core boardSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1348US9954048B2Organic light emitting diode display device with reduced manufacturing costSAMSUNG DISPLAY CO LTD·Filed 2015·Granted Apr 24, 2018·0 cites·8 claims
- 1445US2009038837A1Multilayered printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1543US2012324723A1Method of manufacturing coreless substrateHONG MYEONG HO·Filed 2012·Application pending·0 cites
- 1641US2011048786A1Printed circuit board having a bump and a method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1741US2007045821A1Printed circuit board with dual type inner structureSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1837US2016374196A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →