Inventor · disambiguated record
Chia-Jen Chou
Also filed as: CHOU CHIA JEN
6 granted patents·1 pending application·26 citations·filing 2016–2023
76Inventor score
Top patents by PatentIndex Score
7 records- 0191US9842811B1Heat-dissipating semiconductor package for lessening package warpagePOWERTECH TECHNOLOGY INC·Filed 2016·Granted Dec 12, 2017·15 cites·20 claims
- 0288US9831219B2Manufacturing method of package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Nov 28, 2017·6 cites·20 claims
- 0382US9899287B2Fan-out wafer level package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Granted Feb 20, 2018·5 cites·18 claims
- 0453US2023420386A1Semiconductor packaging emi shielding structure and manufacturing method of the sameREALTEK SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 0546US11488946B2Package method of a modular stacked semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2021·Granted Nov 1, 2022·0 cites·11 claims
- 0634US10249573B2Semiconductor device package with a stress relax patternPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Apr 2, 2019·0 cites·18 claims
- 0730US10126210B2Fault detection and classification matchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →