Inventor · disambiguated record
Hideyo Haruhana
Also filed as: HARUHANA HIDEYO
5 granted patents·5 pending applications·48 citations·filing 1998–2012
78Inventor score
Top patents by PatentIndex Score
10 records- 0170US6861878B2Chopper comparatorRENESAS TECH CORP·Filed 2003·Granted Mar 1, 2005·16 cites·10 claims
- 0261US6611042B2Semiconductor device including resistors isolated and equdistant from diffusion regionsMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 26, 2003·11 cites·16 claims
- 0358US6445071B1Semiconductor device having an improved multi-layer interconnection structure and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 3, 2002·8 cites·6 claims
- 0446US6165878AMethod of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 26, 2000·13 cites·18 claims
- 0539US2003015798A1Semiconductor device and method of fabricating the semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 0638US2002180047A1Method of fabricating a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 0737US2003001270A1Semiconductor device having an improved multi-layer interconnection structure and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 0837US2002081846A1Semiconductor deviceFiled 2001·Application pending·0 cites
- 0934US2001048162A1Semiconductor device having a structure of a multilayer interconnection unit and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Application pending·0 cites
- 1032US8786370B2Power supply control circuitHARUHANA HIDEYO·Filed 2012·Granted Jul 22, 2014·0 cites·7 claims
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