Inventor · disambiguated record
Eberhard Gramatzki
Also filed as: GRAMATZKI EBERHARD · GRAMATZKI EBERHARD B
3 granted patents·164 citations·filing 1997–2005
71Inventor score
Files withIBM3
Top patents by PatentIndex Score
3 records- 0191US6204074B1Chip design process for wire bond and flip-chip packageIBM·Filed 1997·Granted Mar 20, 2001·150 cites·20 claims
- 0285US7119003B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2005·Granted Oct 10, 2006·14 cites·19 claims
- 0339US7067916B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2001·Granted Jun 27, 2006·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →