Inventor · disambiguated record
Michikazu Nakamura
Also filed as: NAKAMURA MICHIKAZU
5 granted patents·5 pending applications·15 citations·filing 2010–2020
70Inventor score
Top patents by PatentIndex Score
10 records- 0184US8286853B2Bonding apparatus and bonding methodAKIYAMA NAOKI·Filed 2011·Granted Oct 16, 2012·9 cites·4 claims
- 0280US9296010B2Coating film forming apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Mar 29, 2016·6 cites·5 claims
- 0342US12065732B2Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Aug 20, 2024·0 cites·8 claims
- 0440US2013216699A1Method and apparatus for filling metal paste, and method for fabricating via plugTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 0540US2014239484A1Method for forming sintered silver coating film, baking apparatus, and semiconductor deviceTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 0637US2021166964A1Film forming apparatusTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 0736US2015214088A1Pickup method and pickup deviceNAKAO KEN·Filed 2011·Application pending·0 cites
- 0835US8749068B2Mounting method and mounting deviceNAKAMURA MICHIKAZU·Filed 2010·Granted Jun 10, 2014·0 cites·16 claims
- 0934US9263312B2Joining device and joining position adjustment method using joining deviceNAKAMURA MICHIKAZU·Filed 2012·Granted Feb 16, 2016·0 cites·13 claims
- 1034US2012291950A1Mounting method and mounting deviceSUGIYAMA MASAHIKO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →