Inventor · disambiguated record
Jay J. Gagnon
Also filed as: GAGNON JAY J
4 granted patents·362 citations·filing 1987–1996
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0188US5289344AIntegrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink meansALLEGRO MICROSYSTEMS INC·Filed 1992·Granted Feb 22, 1994·115 cites·9 claims
- 0287US5859387ASemiconductor device leadframe die attach pad having a raised bond padALLEGRO MICROSYSTEMS INC·Filed 1996·Granted Jan 12, 1999·124 cites·10 claims
- 0385US5012322ASemiconductor die and mounting assemblyALLEGRO MICROSYSTEMS INC·Filed 1987·Granted Apr 30, 1991·86 cites·6 claims
- 0467US4916506AIntegrated-circuit lead-frame package with low-resistance ground-lead and heat-sink meansSPRAGUE ELECTRIC CO·Filed 1988·Granted Apr 10, 1990·37 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →