Inventor · disambiguated record
Cornelia Tsang Yang
Also filed as: YANG CORNELIA T · YANG Cornelia Tsang
17 granted patents·57 citations·filing 2015–2020
91Inventor score
Files withIBM17
Top patents by PatentIndex Score
17 records- 0198US9700891B2Integrated nanofluidic arrays for high capacity colloid separationIBM·Filed 2015·Granted Jul 11, 2017·38 cites·3 claims
- 0289US9833782B2Integrated nanofluidic arrays for high capacity colloid separationIBM·Filed 2016·Granted Dec 5, 2017·3 cites·10 claims
- 0388US10032943B2Device layer thin-film transfer to thermally conductive substrateIBM·Filed 2015·Granted Jul 24, 2018·3 cites·8 claims
- 0487US9947570B2Handler bonding and debonding for semiconductor diesIBM·Filed 2016·Granted Apr 17, 2018·3 cites·16 claims
- 0584US10702866B2Layered silicon and stacking of microfluidic chipsIBM·Filed 2017·Granted Jul 7, 2020·2 cites·15 claims
- 0684US10325785B2Handler bonding and debonding for semiconductor diesIBM·Filed 2017·Granted Jun 18, 2019·2 cites·9 claims
- 0782US10224219B2Handler bonding and debonding for semiconductor diesIBM·Filed 2015·Granted Mar 5, 2019·2 cites·14 claims
- 0877US9876200B2All-silicon hermetic package and processing for narrow, low-profile microbatteriesIBM·Filed 2016·Granted Jan 23, 2018·1 cites·15 claims
- 0976US10586726B2Handler bonding and debonding for semiconductor diesIBM·Filed 2017·Granted Mar 10, 2020·1 cites·11 claims
- 1075US11258132B2Microbattery separatorIBM·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 1172US11121005B2Handler bonding and debonding for semiconductor diesIBM·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 1271US10276439B2Rapid oxide etch for manufacturing through dielectric via structuresIBM·Filed 2017·Granted Apr 30, 2019·2 cites·19 claims
- 1366US11529627B2Layered silicon and stacking of microfluidic chipsIBM·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 1465US10573538B2Handler bonding and debonding for semiconductor diesIBM·Filed 2019·Granted Feb 25, 2020·0 cites·19 claims
- 1564US10388929B2Microbattery separatorIBM·Filed 2015·Granted Aug 20, 2019·0 cites·13 claims
- 1664US10232372B2Integrated nanofluidic arrays for high capacity colloid separationIBM·Filed 2017·Granted Mar 19, 2019·0 cites·20 claims
- 1762US10679887B2Handler bonding and debonding for semiconductor diesIBM·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →