Inventor · disambiguated record
Mohamed Elghazzali
Also filed as: ELGHAZZALI MOHAMED
7 granted patents·3 pending applications·32 citations·filing 2008–2021
81Inventor score
Files withEVATEC AG4WEICHART JUERGEN2EVATEC ADVANCED TECHNOLOGIES AG1OERLIKON ADVANCED TECH AG1OERLIKON ADVANCED TECHNOLOGIES AG1
Top patents by PatentIndex Score
10 records- 0193US10388559B2Apparatus for depositing a layer on a substrate in a processing gasEVATEC AG·Filed 2016·Granted Aug 20, 2019·13 cites·15 claims
- 0289US11380530B2Reactive sputtering with HIPIMSEVATEC AG·Filed 2020·Granted Jul 5, 2022·2 cites·23 claims
- 0387US9644261B2Apparatus for sputtering and a method of fabricating a metallization structureOERLIKON ADVANCED TECH AG·Filed 2014·Granted May 9, 2017·12 cites·7 claims
- 0470US10784092B2Reactive sputtering with HIPIMsWEICHART JUERGEN·Filed 2008·Granted Sep 22, 2020·2 cites·18 claims
- 0567US9490166B2Apparatus and method for depositing a layer onto a substrateRIESCHL SVEN UWE·Filed 2011·Granted Nov 8, 2016·3 cites·16 claims
- 0655US2016108515A1Method for filling vias and substrate-via filling vacuum processing systemEVATEC ADVANCED TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 0751US2015184284A1Method of coating by pulsed bipolar sputteringOERLIKON ADVANCED TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 0850US8691058B2Apparatus for sputtering and a method of fabricating a metallization structureWEICHART JUERGEN·Filed 2009·Granted Apr 8, 2014·0 cites·25 claims
- 0943US2023097276A1Apparatus and process with a dc-pulsed cathode arrayEVATEC AG·Filed 2021·Application pending·0 cites
- 1028US11387079B2Plasma etch chamber and method of plasma etchingEVATEC AG·Filed 2017·Granted Jul 12, 2022·0 cites·34 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →