Inventor · disambiguated record
Ralph D. Hermansen
Also filed as: HERMANSEN RALPH D · HERMANSEN RALPH DAVID
21 granted patents·637 citations·filing 1975–1997
96Inventor score
Files withHUGHES AIRCRAFT CO8DELCO ELECTRONICS CORP5RAYTHEON CO5HERMANSEN RALPH D1HUGHES ELECTRONICS CORP1
Top patents by PatentIndex Score
21 records- 0193US5510138AHot melt conformal coating materialsDELCO ELECTRONICS CORP·Filed 1994·Granted Apr 23, 1996·165 cites·20 claims
- 0293US4866108AFlexible epoxy adhesive blendHUGHES AIRCRAFT CO·Filed 1988·Granted Sep 12, 1989·73 cites·14 claims
- 0385US6060539ARoom-temperature stable, one-component, thermally-conductive, flexible epoxy adhesivesRAYTHEON CO·Filed 1997·Granted May 9, 2000·46 cites·4 claims
- 0476US4045269ATransparent formable polyurethane polycarbonate laminationSIERRACIN CORP·Filed 1975·Granted Aug 30, 1977·46 cites·26 claims
- 0575US5575956ARoom-temperature stable, one-component, electrically-conductive, flexible epoxy adhesivesHUGHES AIRCRAFT CO·Filed 1995·Granted Nov 19, 1996·39 cites·12 claims
- 0674US6723803B1Adhesive of flexible epoxy resin and latent dihydrazideRAYTHEON CO·Filed 1996·Granted Apr 20, 2004·27 cites·2 claims
- 0770US5965673AEpoxy-terminated prepolymer of polyepoxide and diamine with curing agentRAYTHEON CO·Filed 1997·Granted Oct 12, 1999·22 cites·8 claims
- 0870US5929141AAdhesive of epoxy resin, amine-terminated ban and conductive fillerRAYTHEON CO·Filed 1997·Granted Jul 27, 1999·40 cites·3 claims
- 0969US5385966AFrozen premix, fillet-holding urethane adhesives/sealantsHUGHES AIRCRAFT CO·Filed 1994·Granted Jan 31, 1995·30 cites·21 claims
- 1064US5367006ASuperior thermal transfer adhesiveHUGHES AIRCRAFT CO·Filed 1994·Granted Nov 22, 1994·25 cites·2 claims
- 1161US5759730ASolder joint encapsulation materialDELCO ELECTRONICS CORP·Filed 1997·Granted Jun 2, 1998·22 cites·4 claims
- 1260US5608028APolybutadiene urethane potting materialDELCO ELECTRONICS CORP·Filed 1994·Granted Mar 4, 1997·11 cites·20 claims
- 1352US5780581APlateable structural adhesive for cyanate ester compositesHUGHES AIRCRAFT CO·Filed 1995·Granted Jul 14, 1998·17 cites·15 claims
- 1449US5185498ACircuit assembly encapsulated with polybutadiene urethaneDELCO ELECTRONICS CORP·Filed 1991·Granted Feb 9, 1993·15 cites·4 claims
- 1548US5708056AHot melt epoxy encapsulation materialDELCO ELECTRONICS CORP·Filed 1995·Granted Jan 13, 1998·13 cites·13 claims
- 1645US5457165AEncapsulant of amine-cured epoxy resin blendsHUGHES AIRCRAFT CO·Filed 1992·Granted Oct 10, 1995·8 cites·6 claims
- 1745US5350779ALow exotherm, low temperature curing, epoxy impregnantsHUGHES AIRCRAFT CO·Filed 1993·Granted Sep 27, 1994·10 cites·10 claims
- 1841US4940633AMethod of bonding metals with a radio-opaque adhesive/sealant for void detection and product madeHERMANSEN RALPH D·Filed 1989·Granted Jul 10, 1990·16 cites·14 claims
- 1937US6132850AReworkable, thermally-conductive adhesives for electronic assembliesRAYTHEON CO·Filed 1996·Granted Oct 17, 2000·7 cites·10 claims
- 2032US5840829APlateable structural adhesive for cyanate ester compositesHUGHES ELECTRONICS CORP·Filed 1997·Granted Nov 24, 1998·4 cites·8 claims
- 2132US4534882AMethod of making an epoxy prepolymer curing agentHUGHES AIRCRAFT CO·Filed 1984·Granted Aug 13, 1985·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →