Inventor · disambiguated record
Wei-Lan Chiu
Also filed as: CHIU WEI LAN · CHIU WEI LAN WILLIAM
10 granted patents·5 pending applications·18 citations·filing 2011–2023
82Inventor score
Top patents by PatentIndex Score
15 records- 0187US8957323B2Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the sameUNIV NAT CHIAO TUNG·Filed 2013·Granted Feb 17, 2015·10 cites·24 claims
- 0286US10520422B2Optical micro-particles detectorIND TECH RES INST·Filed 2017·Granted Dec 31, 2019·3 cites·22 claims
- 0383US9758886B2Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the sameUNIV NAT CHIAO TUNG·Filed 2015·Granted Sep 12, 2017·2 cites·7 claims
- 0472US12351737B2Chemical mechanical polishing of substrates containing copper and rutheniumBASF SE·Filed 2023·Granted Jul 8, 2025·0 cites·12 claims
- 0571US8980750B2Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate saltBASF SE·Filed 2013·Granted Mar 17, 2015·2 cites·14 claims
- 0669US2024002698A1Chemical mechanical polishing of substrates containing copper and rutheniumBASF SE·Filed 2023·Application pending·0 cites
- 0765US10161054B2Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the sameUNIV NATIONAL CHIAO TUNG·Filed 2017·Granted Dec 25, 2018·0 cites·8 claims
- 0861US9070632B2Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layersRAMAN VIJAY IMMANUEL·Filed 2011·Granted Jun 30, 2015·1 cites·14 claims
- 0959US12087665B2Through substrate via structure and manufacturing method thereof, redistribution layer structure and manufacturing method thereofIND TECH RES INST·Filed 2021·Granted Sep 10, 2024·0 cites·10 claims
- 1055US2022049125A1Chemical mechanical polishing of substrates containing copper and rutheniumBASF SE·Filed 2019·Application pending·0 cites
- 1155US2022064485A1Chemical mechanical polishing of substrates containing copper and rutheniumBASF SE·Filed 2019·Application pending·0 cites
- 1249US12378439B2Compositions for tungsten etching inhibitionBASF SE·Filed 2020·Granted Aug 5, 2025·0 cites·12 claims
- 1346US11725117B2Chemical mechanical polishing of substrates containing copper and rutheniumBASF SE·Filed 2019·Granted Aug 15, 2023·0 cites·17 claims
- 1433US2013168348A1Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon filmsLI YUZHUO·Filed 2011·Application pending·0 cites
- 1532US2016024678A1Preferred oriented au film, method for preparing the same and bonding structure comprising the sameUNIV NAT CHIAO TUNG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →