Inventor · disambiguated record
Benson Liu
Also filed as: LIU BENSON
5 granted patents·2 pending applications·19 citations·filing 2007–2012
74Inventor score
Top patents by PatentIndex Score
7 records- 0181US9601443B2Test structure for seal ring quality monitorTSAI HAO-YI·Filed 2007·Granted Mar 21, 2017·8 cites·20 claims
- 0274US8227917B2Bond pad design for fine pitch wire bondingHSU SHIH-HSUN·Filed 2007·Granted Jul 24, 2012·7 cites·11 claims
- 0372US7859092B2Package structuresTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 28, 2010·4 cites·9 claims
- 0448US8618673B2Package structuresLIU BENSON·Filed 2012·Granted Dec 31, 2013·0 cites·20 claims
- 0545US8237253B2Package structuresLIU BENSON·Filed 2010·Granted Aug 7, 2012·0 cites·18 claims
- 0644US2009081862A1Air gap structure design for advanced integrated circuit technologyTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 0743US2008246031A1PCM pad design for peeling preventionTSAI HAO-YI·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →