Inventor · disambiguated record
Jian Miremadi
Also filed as: MIREMADI JIAN
5 granted patents·438 citations·filing 1997–2021
79Inventor score
Top patents by PatentIndex Score
5 records- 0196US5854507AMultiple chip assemblyHEWLETT PACKARD CO·Filed 1998·Granted Dec 29, 1998·397 cites·15 claims
- 0286US10833438B1Apparatus for surface mount connectorsHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Nov 10, 2020·3 cites·19 claims
- 0366US5889332AArea matched packageHEWLETT PACKARD CO·Filed 1997·Granted Mar 30, 1999·38 cites·10 claims
- 0463US11705652B2Apparatus for surface mount connectorsHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted Jul 18, 2023·0 cites·15 claims
- 0553US11927436B2Measurement machine and method for detecting a defect in solder jointsHEWLETT PACKARD ENTPR DEV LP·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →