Inventor · disambiguated record
Yoshikazu Saijo
Also filed as: SAIJO YOSHIKAZU
11 granted patents·4 pending applications·29 citations·filing 2000–2020
84Inventor score
Files withUEMURA KOGYO KK6SAIJO YOSHIKAZU3UYEMURA C & CO LTD3OSAKA MUNICIPAL GOVERNMENT2YAMAMOTO HISAMITSU1
Top patents by PatentIndex Score
15 records- 0186US10138558B2Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using sameUEMURA KOGYO KK·Filed 2016·Granted Nov 27, 2018·3 cites·6 claims
- 0273US9374913B2Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using sameUYEMURA C & CO LTD·Filed 2014·Granted Jun 21, 2016·3 cites·4 claims
- 0371US6723679B2Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide filmOSAKA MUNICIPAL GOVERNMENT·Filed 2002·Granted Apr 20, 2004·12 cites·6 claims
- 0469US6406750B1Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide filmOSAKA MUNICIPAL GOVERNMENT·Filed 2000·Granted Jun 18, 2002·11 cites·12 claims
- 0564US2021047734A1Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring boardUEMURA KOGYO KK·Filed 2020·Application pending·0 cites
- 0657US11421325B2Method for producing a printed wiring boardUEMURA KOGYO KK·Filed 2020·Granted Aug 23, 2022·0 cites·4 claims
- 0757US10927463B2Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring boardUEMURA KOGYO KK·Filed 2017·Granted Feb 23, 2021·0 cites·2 claims
- 0856US7988773B2Electroless gold plating bath, electroless gold plating method and electronic partsUYEMURA C & CO LTD·Filed 2007·Granted Aug 2, 2011·0 cites·11 claims
- 0954US7985285B2Electroless gold plating bath, electroless gold plating method and electronic partsUYEMURA C & CO LTD·Filed 2007·Granted Jul 26, 2011·0 cites·11 claims
- 1048US8877020B2Electrolytic regeneration unit and electrolytic regeneration apparatus using sameYAMAMOTO HISAMITSU·Filed 2012·Granted Nov 4, 2014·0 cites·14 claims
- 1148US2021289637A1Method for producing printed wiring boardUEMURA KOGYO KK·Filed 2017·Application pending·0 cites
- 1247US10773280B2Ultrasonic treatment apparatusUEMURA KOGYO KK·Filed 2017·Granted Sep 15, 2020·0 cites·14 claims
- 1339US9045836B2Electrolytic regeneration deviceSAIJO YOSHIKAZU·Filed 2011·Granted Jun 2, 2015·0 cites·9 claims
- 1435US2014339463A1Desmear solution and desmear methodSAIJO YOSHIKAZU·Filed 2012·Application pending·0 cites
- 1533US2012167916A1Neutralizing/reducing agent, and desmear methodSAIJO YOSHIKAZU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →