Inventor · disambiguated record
Joan K. Vrtis
Also filed as: VRTIS JOAN · VRTIS JOAN K · VRTIS JOAN KENNETHA
15 granted patents·6 pending applications·344 citations·filing 2000–2019
93Inventor score
Top patents by PatentIndex Score
21 records- 0196US6407929B1Electronic package having embedded capacitors and method of fabrication thereforINTEL CORP·Filed 2000·Granted Jun 18, 2002·220 cites·29 claims
- 0292US9521748B1Mechanical measures to limit stress and strain in deformable electronicsMULTEK TECH LTD·Filed 2014·Granted Dec 13, 2016·16 cites·24 claims
- 0391US10154583B1Mechanical strain reduction on flexible and rigid-flexible circuitsMULTEK TECH LIMITED·Filed 2016·Granted Dec 11, 2018·8 cites·17 claims
- 0491US6751099B2Coated heat spreadersINTEL CORP·Filed 2001·Granted Jun 15, 2004·47 cites·15 claims
- 0588US9723713B1Flexible printed circuit board hingeMULTEK TECH LTD·Filed 2015·Granted Aug 1, 2017·8 cites·22 claims
- 0686US9661743B1Flexible circuit board and method of fabricatingMULTEK TECH LTD·Filed 2014·Granted May 23, 2017·5 cites·20 claims
- 0786US9549463B1Rigid to flexible PC transitionMULTEK TECH LTD·Filed 2015·Granted Jan 17, 2017·6 cites·18 claims
- 0885US10123603B1Diffuse fiber optic lighting for luggageMULTEK TECH LIMITED·Filed 2016·Granted Nov 13, 2018·5 cites·21 claims
- 0984US10009992B2PCB hybrid redistribution layerMULTEK TECH LIMITED·Filed 2016·Granted Jun 26, 2018·7 cites·22 claims
- 1083US9521754B1Embedded components in a substrateFLEXTRONICS AP LLC·Filed 2014·Granted Dec 13, 2016·6 cites·6 claims
- 1178US10015880B1Rip stop on flex and rigid flex circuitsMULTEK TECH LTD·Filed 2014·Granted Jul 3, 2018·3 cites·20 claims
- 1275US10499500B2Circuit board with embedded metal pallet and a method of fabricating the circuit boardFLEX LTD·Filed 2017·Granted Dec 3, 2019·3 cites·17 claims
- 1368US9736947B1Nano-copper via fill for enhanced thermal conductivity of plated through-hole viaMULTEK TECH LTD·Filed 2014·Granted Aug 15, 2017·1 cites·5 claims
- 1465US7219421B2Method of a coating heat spreaderINTEL CORP·Filed 2004·Granted May 22, 2007·9 cites·15 claims
- 1543US12402659B2Heater assembly comprising a printed circuit boardPHILIP MORRIS PRODUCTS SA·Filed 2019·Granted Sep 2, 2025·0 cites·12 claims
- 1642US2008136019A1Solder Bump/Under Bump Metallurgy Structure for High Temperature ApplicationsJOHNSON MICHAEL E·Filed 2006·Application pending·0 cites
- 1741US2009054799A1Biosensor system with a multifunctional portable electronic deviceVRTIS JOAN K·Filed 2008·Application pending·0 cites
- 1838US2006258048A1Integrated capacitor for wafer level packaging applicationsEKUBIK CONSULTING LLC·Filed 2006·Application pending·0 cites
- 1935US2009014869A1Semiconductor device package with bump overlying a polymer layerVRTIS JOAN K·Filed 2005·Application pending·0 cites
- 2033US2004160753A1System and method for packaging electronic componentsFiled 2004·Application pending·0 cites
- 2132US2004125563A1Coating for a heat dissipation device and a method of fabricationFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →