Inventor · disambiguated record
Alexander William Copia
Also filed as: COPIA ALEXANDER W · COPIA ALEXANDER WILLIAM
4 granted patents·345 citations·filing 2000–2009
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0197US6201305B1Making solder ball mounting pads on substratesAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 13, 2001·245 cites·18 claims
- 0294US8937381B1Thin stackable package and methodDUNLAP BRETT ARNOLD·Filed 2009·Granted Jan 20, 2015·58 cites·18 claims
- 0386US7755176B1Die-mounting substrate and method incorporating dummy traces for improving mounting film planarityAMKOR TECHNOLOGY INC·Filed 2005·Granted Jul 13, 2010·23 cites·15 claims
- 0484US8836115B1Stacked inverted flip chip package and fabrication methodST AMAND ROGER D·Filed 2008·Granted Sep 16, 2014·19 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →