Inventor · disambiguated record
Rei Yoneyama
Also filed as: YONEYAMA REI
36 granted patents·1 pending application·278 citations·filing 2012–2023
96Inventor score
Top patents by PatentIndex Score
37 records- 0197US9418975B1Semiconductor module, power conversion device, and method for manufacturing semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 16, 2016·29 cites·9 claims
- 0293USD766851SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Sep 20, 2016·43 cites·1 claims
- 0391US10116302B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 30, 2018·8 cites·13 claims
- 0491USD773412SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Dec 6, 2016·34 cites·1 claims
- 0590USD773413SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Dec 6, 2016·31 cites·1 claims
- 0690USD767516SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Sep 27, 2016·35 cites·1 claims
- 0789US9613888B2Semiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 4, 2017·13 cites·14 claims
- 0888USD864884SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 29, 2019·27 cites·1 claims
- 0986US10771053B2Semiconductor device having first and second switching regions respectively controlled by first and second control signals output by a controllerMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Sep 8, 2020·5 cites·11 claims
- 1080USD759604SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 21, 2016·21 cites·1 claims
- 1175US10366964B2Semiconductor device having switching elements to prevent overcurrent damageMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 30, 2019·2 cites·15 claims
- 1275US9406624B2Semiconductor module and power converterMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 2, 2016·2 cites·14 claims
- 1373US10714447B2Electrode terminal, semiconductor device, and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 14, 2020·2 cites·14 claims
- 1473USD873227SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jan 21, 2020·11 cites·1 claims
- 1572US10727150B2Semiconductor module and power converterMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 28, 2020·2 cites·4 claims
- 1672US10290555B2Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wallMITSUBISHI ELECTRIC CORP·Filed 2016·Granted May 14, 2019·2 cites·7 claims
- 1772US9578754B2Metal base substrate, power module, and method for manufacturing metal base substrateMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 21, 2017·2 cites·20 claims
- 1868US9252087B2Electronic circuit, production method thereof, and electronic componentMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Feb 2, 2016·2 cites·9 claims
- 1967US10325825B2Semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jun 18, 2019·1 cites·16 claims
- 2060US12500135B2Semiconductor device comprising semiconductor element; insulating component; lead electrode; and first bonding material, second bonding material, third bonding material, and fourth bonding material made of a same materialMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Dec 16, 2025·0 cites·22 claims
- 2159US2024258134A1Semiconductor manufacturing apparatus and method for manufacturing a semiconductor manufacturing apparatusMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2255US11680979B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jun 20, 2023·0 cites·8 claims
- 2353USD783549SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Apr 11, 2017·6 cites·1 claims
- 2450US10861756B2Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wallMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Dec 8, 2020·0 cites·8 claims
- 2548US10453780B2Electronic circuit, production method thereof, and electronic componentMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Oct 22, 2019·0 cites·7 claims
- 2648US9159676B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 13, 2015·0 cites·10 claims
- 2744US11581307B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 14, 2023·0 cites·15 claims
- 2844US9723718B2Electronic component mounting device and semiconductor device including the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Aug 1, 2017·0 cites·12 claims
- 2943US9774112B2Press-fit terminal, semiconductor device, power conversion apparatus and method of manufacturing press-fit terminalMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 26, 2017·0 cites·7 claims
- 3043US9653369B2Power semiconductor module comprising a case, base plate, and spacerMITSUBISHI ELECTRIC CORP·Filed 2016·Granted May 16, 2017·0 cites·5 claims
- 3142US11183834B2Semiconductor module and power conversion apparatus having a diode bridge circuit and a protection circuitMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Nov 23, 2021·0 cites·9 claims
- 3242US9125308B2Semiconductor device and method of manufacturing thereofOBARA TAICHI·Filed 2013·Granted Sep 1, 2015·0 cites·9 claims
- 3342US8823018B2Semiconductor module including a switching element formed of a wide bandgap semiconductorYONEYAMA REI·Filed 2012·Granted Sep 2, 2014·0 cites·7 claims
- 3439US11114836B2Semiconductor device, intelligent power module and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 7, 2021·0 cites·18 claims
- 3539US10062632B2Semiconductor device having improved heat dissipation efficiencyMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 28, 2018·0 cites·7 claims
- 3639US9627293B2Semiconductor device and heat-conductive sheetMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Apr 18, 2017·0 cites·11 claims
- 3738US10338128B2Life estimation circuit and semiconductor device made using the sameMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 2, 2019·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Rei Yoneyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →