Inventor · disambiguated record
Yeow Meng Teo
Also filed as: TEO YEOW M · TEO YEOW MENG
20 granted patents·3 pending applications·221 citations·filing 1995–2023
93Inventor score
Top patents by PatentIndex Score
23 records- 0186US11424396B2Flip chip LED with side reflectors and phosphorLUMILEDS LLC·Filed 2016·Granted Aug 23, 2022·4 cites·12 claims
- 0282US6306721B1Method of forming salicided poly to metal capacitorCHARTERED SEMICONDUCTOR MAUFAC·Filed 2001·Granted Oct 23, 2001·57 cites·24 claims
- 0378US5627094AStacked container capacitor using chemical mechanical polishingCHARTERED SEMICONDUCTOR MFG·Filed 1995·Granted May 6, 1997·40 cites·21 claims
- 0476US5808855AStacked container capacitor using chemical mechanical polishingCHARTERED SEMICONDUCTOR MFG·Filed 1996·Granted Sep 15, 1998·35 cites·6 claims
- 0573US5970374AMethod for forming contacts and vias with improved barrier metal step-coverageCHARTERED SEMICONDUCTOR MFG·Filed 1996·Granted Oct 19, 1999·47 cites·34 claims
- 0671US11784286B2Light emitting diode devices with defined hard mask openingLUMILEDS LLC·Filed 2022·Granted Oct 10, 2023·0 cites·18 claims
- 0766US10916683B2Contact etching and metallization for improved LED device performance and reliabilityLUMILEDS LLC·Filed 2020·Granted Feb 9, 2021·0 cites·20 claims
- 0865US12040423B2Methods of making flip chip micro light emitting diodesLUMILEDS LLC·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0960US12057535B2Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphorLUMILEDS LLC·Filed 2022·Granted Aug 6, 2024·0 cites·19 claims
- 1060US11569415B2Light emitting diode devices with defined hard mask openingLUMILEDS LLC·Filed 2021·Granted Jan 31, 2023·0 cites·6 claims
- 1155US12484346B2Light emitting diode devices with bonding and/or ohmic contact-reflective materialLUMILEDS LLC·Filed 2022·Granted Nov 25, 2025·0 cites·18 claims
- 1254US11705534B2Methods of making flip chip micro light emitting diodesLUMILEDS LLC·Filed 2021·Granted Jul 18, 2023·0 cites·19 claims
- 1352US12402440B2Light emitting diode devices with bonding and/or ohmic contact-reflective materialLUMILEDS LLC·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1450US6607993B1Method using ultraviolet radiation for integrated circuit manufacturingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Aug 19, 2003·7 cites·18 claims
- 1549US2025038154A1Test Apparatus For Flip-Chip Micro-Light Emitting Diode (LED) DevicesLUMILEDS LLC·Filed 2022·Application pending·0 cites
- 1649US2025046660A1Testable Flip-Chip Micro-Light Emitting Diode (LED) DevicesLUMILEDS LLC·Filed 2022·Application pending·0 cites
- 1748US2023075707A1Metal stacks for light emitting diodes for bonding and/or ohmic contact-reflective materialLUMILEDS LLC·Filed 2022·Application pending·0 cites
- 1847US6368900B1Method of fabricating an antifuse elementCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 9, 2002·5 cites·23 claims
- 1946US5895264AMethod for forming stacked polysiliconCHARTERED SEMICONDUCTOR MFG·Filed 1997·Granted Apr 20, 1999·14 cites·40 claims
- 2045US11955583B2Flip chip micro light emitting diodesLUMILEDS LLC·Filed 2021·Granted Apr 9, 2024·0 cites·21 claims
- 2145US10529894B2Contact etching and metallization for improved LED device performance and reliabilityCHONG DAVID·Filed 2016·Granted Jan 7, 2020·0 cites·10 claims
- 2240US5624871AMethod for making electrical local interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 1996·Granted Apr 29, 1997·12 cites·19 claims
- 2322US6362102B1Method of forming top metal contact to antifuseCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Mar 26, 2002·0 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →