Inventor · disambiguated record
Hsiu-Ju Yang
Also filed as: YANG HSIU-JU
4 granted patents·4 pending applications·3 citations·filing 2008–2023
61Inventor score
Top patents by PatentIndex Score
8 records- 0183US11901694B2Package structureIREACH CORP·Filed 2021·Granted Feb 13, 2024·1 cites·7 claims
- 0275US2024128713A1Package structureIREACH CORP·Filed 2023·Application pending·0 cites
- 0362US2025167515A1Semiconductor laser and packaging structure thereofIREACH CORP·Filed 2023·Application pending·0 cites
- 0461US8378987B2Sensing method and circuit for a capacitive touch panelELAN MICROELECTRONICS CORP·Filed 2010·Granted Feb 19, 2013·2 cites·8 claims
- 0558US2023005900A1Chip package structure and application thereofIREACH CORP·Filed 2022·Application pending·0 cites
- 0655US2022085571A1Laser Package StructureIREACH CORP·Filed 2021·Application pending·0 cites
- 0745US8476563B2Induction heating cooker and control circuit thereforGONG PEI-MIN·Filed 2008·Granted Jul 2, 2013·0 cites·44 claims
- 0844US9313830B2Induction heating cooker and control circuit thereforGONG PEI-MIN·Filed 2012·Granted Apr 12, 2016·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →