Inventor · disambiguated record
Mitsuaki Katagiri
Also filed as: KATAGIRI MITSUAKI
63 granted patents·16 pending applications·760 citations·filing 1997–2021
99Inventor score
Top patents by PatentIndex Score
79 records- 0198US10115709B1Apparatuses comprising semiconductor dies in face-to-face arrangementsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 30, 2018·23 cites·18 claims
- 0296US7466577B2Semiconductor storage device having a plurality of stacked memory chipsHITACHI LTD INTELLECTUAL PROPE·Filed 2006·Granted Dec 16, 2008·107 cites·19 claims
- 0395US7119428B2Semiconductor deviceELPIDA MEMORY INC·Filed 2004·Granted Oct 10, 2006·109 cites·8 claims
- 0493US11705432B2Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·2 cites·18 claims
- 0592US8426983B2Semiconductor deviceTAKEDA HIROMASA·Filed 2011·Granted Apr 23, 2013·19 cites·22 claims
- 0692US6861742B2Wafer level chip size package having rerouting layersRENESAS TECH CORP·Filed 2002·Granted Mar 1, 2005·64 cites·19 claims
- 0791US6867123B2Semiconductor integrated circuit device and its manufacturing methodRENESAS TECH CORP·Filed 2001·Granted Mar 15, 2005·76 cites·21 claims
- 0890US7851898B2Multichip package or system-in packageHITACHI LTD·Filed 2006·Granted Dec 14, 2010·21 cites·7 claims
- 0988US8243465B2Semiconductor device with additional power supply pathsITAYA SATOSHI·Filed 2010·Granted Aug 14, 2012·13 cites·15 claims
- 1088US7391113B2Semiconductor deviceELPIDA MEMORY INC·Filed 2006·Granted Jun 24, 2008·14 cites·11 claims
- 1187US7823096B2Inductance analysis system and method and program thereforELPIDA MEMORY INC·Filed 2006·Granted Oct 26, 2010·17 cites·9 claims
- 1285US7777350B2Semiconductor stack package having wiring extension part which has hole for wiringELPIDA MEMORY INC·Filed 2008·Granted Aug 17, 2010·13 cites·18 claims
- 1384US9418967B2Semiconductor devicePS4 LUXCO SARL·Filed 2013·Granted Aug 16, 2016·7 cites·6 claims
- 1483US7546506B2DRAM stacked package, DIMM, and semiconductor manufacturing methodHITACHI LTD·Filed 2006·Granted Jun 9, 2009·15 cites·7 claims
- 1583US6841881B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Jan 11, 2005·32 cites·12 claims
- 1680US7345892B2Semiconductor device, noise reduction method, and shield coverNEC CORP·Filed 2005·Granted Mar 18, 2008·9 cites·18 claims
- 1778US8164186B2BGA semiconductor device having a dummy bumpWATANABE YUJI·Filed 2005·Granted Apr 24, 2012·8 cites·5 claims
- 1878US6867502B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Mar 15, 2005·27 cites·18 claims
- 1978US6828174B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Dec 7, 2004·23 cites·6 claims
- 2077US8487433B2Semiconductor deviceHASEGAWA YU·Filed 2011·Granted Jul 16, 2013·4 cites·20 claims
- 2177US8222737B2BGA semiconductor device having a dummy bumpWATANABE YUJI·Filed 2010·Granted Jul 17, 2012·4 cites·7 claims
- 2277US6812565B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Nov 2, 2004·25 cites·12 claims
- 2375US9595489B2Semiconductor package with bonding wires of reduced loop inductancePS4 LUXCO SARL·Filed 2013·Granted Mar 14, 2017·3 cites·6 claims
- 2474US7538431B2Semiconductor deviceELPIDA MEMORY INC·Filed 2008·Granted May 26, 2009·5 cites·13 claims
- 2573US11081468B2Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatusesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 3, 2021·1 cites·32 claims
- 2673US7569428B2Method for manufacturing semiconductor device, semiconductor device and apparatus comprising sameELPIDA MEMORY INC·Filed 2006·Granted Aug 4, 2009·6 cites·17 claims
- 2773US5892276ASemiconductor integrated circuitHITACHI LTD·Filed 1997·Granted Apr 6, 1999·42 cites·20 claims
- 2869US9048221B2Device having electrodes formed from bumps with different diametersPS4 LUXCO SARL·Filed 2012·Granted Jun 2, 2015·2 cites·16 claims
- 2969US7875986B2Semiconductor deviceELPIDA MEMORY INC·Filed 2007·Granted Jan 25, 2011·4 cites·20 claims
- 3067US8569898B2Semiconductor deviceTAKEDA HIROMASA·Filed 2010·Granted Oct 29, 2013·2 cites·16 claims
- 3167US8372693B2Semiconductor device including semiconductor chips with different thicknessELPIDA MEMORY INC·Filed 2012·Granted Feb 12, 2013·2 cites·20 claims
- 3267US7714424B2Stacked-type semiconductor packageELPIDA MEMORY INC·Filed 2008·Granted May 11, 2010·3 cites·1 claims
- 3367US7375422B2Stacked-type semiconductor packageELPIDA MEMORY INC·Filed 2005·Granted May 20, 2008·3 cites·13 claims
- 3466US7689944B2Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor packageELPIDA MEMORY INC·Filed 2006·Granted Mar 30, 2010·3 cites·65 claims
- 3565US8853822B2Semiconductor deviceELPIDA MEMORY INC·Filed 2012·Granted Oct 7, 2014·2 cites·10 claims
- 3665US8581417B2Semiconductor device stack with bonding layer and wire retaining memberHASEGAWA YU·Filed 2010·Granted Nov 12, 2013·2 cites·19 claims
- 3765US7956470B2Semiconductor deviceELPIDA MEMORY INC·Filed 2006·Granted Jun 7, 2011·3 cites·14 claims
- 3863US9589921B2Semiconductor devicePS4 LUXCO SARL·Filed 2014·Granted Mar 7, 2017·1 cites·13 claims
- 3963US8970052B2Semiconductor device stack with bonding layer and wire retaining memberPS4 LUXCO SARL·Filed 2013·Granted Mar 3, 2015·1 cites·20 claims
- 4062US10600762B2Apparatuses comprising semiconductor dies in face-to-face arrangementsMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 24, 2020·0 cites·8 claims
- 4161US8362614B2Fine pitch grid array type semiconductor deviceELPIDA MEMORY INC·Filed 2005·Granted Jan 29, 2013·2 cites·11 claims
- 4260US7960846B2Semiconductor device having improved solder joint and internal lead lifetimesELPIDA MEMORY INC·Filed 2009·Granted Jun 14, 2011·1 cites·5 claims
- 4358US10431566B2Apparatuses comprising semiconductor dies in face-to-face arrangementsMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·0 cites·12 claims
- 4458US7681154B2Method for designing device, system for aiding to design device, and computer program product thereforELPIDA MEMORY INC·Filed 2007·Granted Mar 16, 2010·1 cites·47 claims
- 4557US7847377B2Semiconductor device including semiconductor chip with two pad rowsELPIDA MEMORY INC·Filed 2006·Granted Dec 7, 2010·1 cites·13 claims
- 4654US8941237B2Semiconductor deviceELPIDA MEMORY INC·Filed 2013·Granted Jan 27, 2015·0 cites·17 claims
- 4753US6297544B1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Oct 2, 2001·17 cites·19 claims
- 4853US2010224984A1Semiconductor device and stacked semiconductor device in which circuit board and semiconductor chip are connected by leadsELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 4952US8796077B2Semiconductor deviceELPIDA MEMORY INC·Filed 2013·Granted Aug 5, 2014·0 cites·16 claims
- 5052US8513803B2Semiconductor device and stacked semiconductor deviceELPIDA MEMORY INC·Filed 2012·Granted Aug 20, 2013·0 cites·20 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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