Inventor · disambiguated record
Shinichi Wakita
Also filed as: WAKITA SHINICHI
11 granted patents·1 pending application·351 citations·filing 1987–2016
93Inventor score
Top patents by PatentIndex Score
12 records- 0188US4801489APrinted circuit board capable of preventing electromagnetic interferenceNINTENDO CO LTD·Filed 1987·Granted Jan 31, 1989·67 cites·35 claims
- 0284US4789411AConductive copper paste compositionTATSUTA DENSEN KK·Filed 1987·Granted Dec 6, 1988·52 cites·26 claims
- 0382US5981043AElectroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shieldTATSUTA DENSEN KK·Filed 1997·Granted Nov 9, 1999·74 cites·5 claims
- 0472US5341274APrinted circuit board with enhanced EMI suppressionTATSUTA DENSEN KK·Filed 1990·Granted Aug 23, 1994·31 cites·5 claims
- 0568US5567357AConductive paint having good adhesion to molding of metallic oxideTATSUTA DENSEN KK·Filed 1994·Granted Oct 22, 1996·26 cites·2 claims
- 0663US5825689ANonvolatile semiconductor memory device having data detecting circuit for memory cells blockNEC CORP·Filed 1997·Granted Oct 20, 1998·20 cites·6 claims
- 0760US5736070AElectroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shieldTATSUTA DENSEN KK·Filed 1996·Granted Apr 7, 1998·27 cites·6 claims
- 0855US5917751ANonvolatile semiconductor memory deviceNEC CORP·Filed 1998·Granted Jun 29, 1999·14 cites·2 claims
- 0954US5466893APrinted circuit board having enhanced EMI suppressionTATSUTA DENSEN KK·Filed 1994·Granted Nov 14, 1995·18 cites·7 claims
- 1048US6274422B1Method for manufacturing a semiconductor deviceNEC CORP·Filed 1999·Granted Aug 14, 2001·11 cites·2 claims
- 1147US5449863APrinted circuit boardTATSUTA DENSEN KK·Filed 1994·Granted Sep 12, 1995·11 cites·13 claims
- 1244US2018163069A1Conductive PasteTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →