Inventor · disambiguated record
Ryuji Koga
Also filed as: KOGA RYUJI
6 granted patents·4 pending applications·27 citations·filing 1992–2021
76Inventor score
Top patents by PatentIndex Score
10 records- 0162US11034623B2Thermal conductive member and heat dissipation structure including the sameDENKA COMPANY LTD·Filed 2018·Granted Jun 15, 2021·1 cites·7 claims
- 0262US10615096B2Heat dissipation structure for electric circuit deviceDENKA COMPANY LTD·Filed 2017·Granted Apr 7, 2020·1 cites·4 claims
- 0360US6469259B2Wiring boardKYOCERA CORP·Filed 2001·Granted Oct 22, 2002·15 cites·23 claims
- 0450US2023271888A1Composite and production method for compositeDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 0546US5172083AMicrowave plasma processing apparatusNIPPON STEEL CORP·Filed 1992·Granted Dec 15, 1992·10 cites·17 claims
- 0646US2023227370A1Composite body and layered bodyDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
- 0744US12083784B2Temporary bonding body of ceramic resin composite and metal plate, method for producing same, object to be transported including the temporary bonding body, and method for transporting sameDENKA COMPANY LTD·Filed 2019·Granted Sep 10, 2024·0 cites·5 claims
- 0840US2022250994A1Method for producing composite bodyDENKA COMPANY LTD·Filed 2020·Application pending·0 cites
- 0940US2022177375A1Composite bodyDENKA COMPANY LTD·Filed 2020·Application pending·0 cites
- 1036US11492299B2Nitride ceramic resin composite bodyDENKA COMPANY LTD·Filed 2018·Granted Nov 8, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →