Inventor · disambiguated record
Chun Hung Samuel Ip
Also filed as: IP CHUN HUNG SAMUEL
3 granted patents·2 pending applications·9 citations·filing 2007–2013
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0166US8012866B2Method of bonding semiconductor devices utilizing solder ballsASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Sep 6, 2011·5 cites·19 claims
- 0261US10399170B2Die attachment apparatus and method utilizing activated forming gasLAM KUI KAM·Filed 2013·Granted Sep 3, 2019·2 cites·18 claims
- 0357US7735715B2Dispensing solder for mounting semiconductor chipsASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Jun 15, 2010·2 cites·8 claims
- 0440US2013119113A1System for dispensing soft solder for mounting semiconductor chips using multiple solder wiresLAM KUI KAM·Filed 2013·Application pending·0 cites
- 0535US2011272452A1System for dispensing soft solder for mounting semiconductor chips using multiple solder wiresLAM KUI KAM·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →