Inventor · disambiguated record
Gyuhee Park
Also filed as: PARK GYUHEE
5 granted patents·7 pending applications·0 citations·filing 2020–2025
59Inventor score
Files withSAMSUNG ELECTRONICS CO LTD12
Top patents by PatentIndex Score
12 records- 0161US12378272B2Yttrium compound and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·11 claims
- 0259US2025163081A1Silicon compounds and methods of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0358US2025305120A1Method for selective deposition of layer of interestSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0457US12473309B2Organometallic compound and method of manufacturing integrated circuit using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 0557US2022380390A1Silicon compounds and methods of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0656US2024067663A1Yttrium compound, source material for forming yttrium-containing film, and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0755US11746121B2Molybdenum compound and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 0855US2022324887A1Organometallic adduct compound and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0954US12410203B2Organometallic adduct compound and method of manufacturing integrated circuit using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 9, 2025·0 cites·17 claims
- 1053US2025062228A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1151US11466043B2Niobium compound and method of forming thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·17 claims
- 1249US2023406822A1Silicon compound and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →