Inventor · disambiguated record
Nitin A. Deshpande
Also filed as: DESHPANDE JR NITIN A · DESHPANDE NITIN · DESHPANDE NITIN A · DESHPANDE NITIN ASHOK
82 granted patents·56 pending applications·266 citations·filing 2004–2025
99Inventor score
Top patents by PatentIndex Score
138 records- 0198US9275955B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2013·Granted Mar 1, 2016·49 cites·17 claims
- 0297US11521931B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Dec 6, 2022·7 cites·18 claims
- 0397US9754890B2Embedded multi-device bridge with through-bridge conductive via signal connectionINTEL CORP·Filed 2014·Granted Sep 5, 2017·35 cites·20 claims
- 0496US12148742B2Active bridge enabled co-packaged photonic transceiverINTEL CORP·Filed 2020·Granted Nov 19, 2024·6 cites·15 claims
- 0596US11373972B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Jun 28, 2022·9 cites·18 claims
- 0694US12412842B2Microelectronic structures including bridgesINTEL CORP·Filed 2023·Granted Sep 9, 2025·2 cites·20 claims
- 0794US9899238B2Low cost package warpage solutionINTEL CORP·Filed 2014·Granted Feb 20, 2018·11 cites·13 claims
- 0893US10068852B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2017·Granted Sep 4, 2018·8 cites·19 claims
- 0993US9691711B2Method of making an electromagnetic interference shield for semiconductor chip packagesINTEL CORP·Filed 2016·Granted Jun 27, 2017·9 cites·18 claims
- 1092US12399334B2Photonic integrated circuit packaging architecturesINTEL CORP·Filed 2021·Granted Aug 26, 2025·2 cites·20 claims
- 1192US12392970B2Photonic integrated circuit packaging architecturesINTEL CORP·Filed 2021·Granted Aug 19, 2025·2 cites·20 claims
- 1292US10192810B2Underfill material flow control for reduced die-to-die spacing in semiconductor packagesINTEL CORP·Filed 2013·Granted Jan 29, 2019·13 cites·9 claims
- 1391US10741419B2Low cost package warpage solutionINTEL CORP·Filed 2019·Granted Aug 11, 2020·4 cites·20 claims
- 1490US12061371B2Patch on interposer architecture for low cost optical co-packagingINTEL CORP·Filed 2020·Granted Aug 13, 2024·2 cites·25 claims
- 1590US9716067B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2016·Granted Jul 25, 2017·6 cites·6 claims
- 1689US7534715B2Methods including fluxless chip attach processesINTEL CORP·Filed 2005·Granted May 19, 2009·22 cites·25 claims
- 1789US7312527B2Low temperature phase change thermal interface material damINTEL CORP·Filed 2005·Granted Dec 25, 2007·18 cites·22 claims
- 1889US2025096009A1Low cost package warpage solutionINTEL CORP·Filed 2024·Application pending·0 cites
- 1985US12422615B2Nested glass packaging architecture for hybrid electrical and optical communication devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·11 claims
- 2085US12183596B2Low cost package warpage solutionINTEL CORP·Filed 2023·Granted Dec 31, 2024·0 cites·18 claims
- 2185US9576942B1Integrated circuit assembly that includes stacked diceINTEL CORP·Filed 2015·Granted Feb 21, 2017·4 cites·14 claims
- 2284US11328937B2Low cost package warpage solutionINTEL CORP·Filed 2020·Granted May 10, 2022·1 cites·33 claims
- 2384US9741692B2Methods to form high density through-mold interconnectionsKARHADE OMKAR G·Filed 2014·Granted Aug 22, 2017·7 cites·14 claims
- 2483US9502368B2Picture frame stiffeners for microelectronic packagesINTEL CORP·Filed 2014·Granted Nov 22, 2016·5 cites·11 claims
- 2580US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 2680US10797000B2Embedded multi-device bridge with through-bridge conductive via signal connectionINTEL CORP·Filed 2019·Granted Oct 6, 2020·2 cites·14 claims
- 2780US9685421B2Methods for high precision microelectronic die integrationINTEL CORP·Filed 2015·Granted Jun 20, 2017·3 cites·17 claims
- 2880US2025060531A1Photonic integrated circuit packaging architectureINTEL CORP·Filed 2024·Application pending·0 cites
- 2979US12027448B2Open cavity bridge power delivery architectures and processesINTEL CORP·Filed 2020·Granted Jul 2, 2024·1 cites·11 claims
- 3079US11764080B2Low cost package warpage solutionINTEL CORP·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 3179US10229882B2Embedded multi-device bridge with through-bridge conductive via signal connectionINTEL CORP·Filed 2017·Granted Mar 12, 2019·2 cites·19 claims
- 3277US10256198B2Warpage control for microelectronics packagesINTEL CORP·Filed 2017·Granted Apr 9, 2019·2 cites·21 claims
- 3374US9583470B2Electronic device with solder pads including projectionsINTEL CORP·Filed 2013·Granted Feb 28, 2017·3 cites·8 claims
- 3473US10595409B2Electro-magnetic interference (EMI) shielding techniques and configurationsINTEL CORP·Filed 2017·Granted Mar 17, 2020·1 cites·8 claims
- 3572US11676900B2Electronic assembly that includes a bridgeINTEL CORP·Filed 2015·Granted Jun 13, 2023·2 cites·12 claims
- 3672US9659899B2Die warpage control for thin die assemblyINTEL CORP·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 3771US9368455B2Electromagnetic interference shield for semiconductor chip packagesMAHAJAN RAVINDRANATH V·Filed 2014·Granted Jun 14, 2016·3 cites·13 claims
- 3870US12181710B2Photonic integrated circuit packaging architectureINTEL CORP·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 3970US10672626B2Method and materials for warpage thermal and interconnect solutionsINTEL CORP·Filed 2017·Granted Jun 2, 2020·1 cites·7 claims
- 4070US9713255B2Electro-magnetic interference (EMI) shielding techniques and configurationsINTEL CORP·Filed 2014·Granted Jul 18, 2017·2 cites·18 claims
- 4170US9397071B2High density interconnection of microelectronic devicesINTEL CORP·Filed 2013·Granted Jul 19, 2016·2 cites·12 claims
- 4270US2024136292A1Microelectronic structures including bridgesINTEL CORP·Filed 2023·Application pending·0 cites
- 4369US7644871B2Flux spray atomization and splash controlINTEL CORP·Filed 2006·Granted Jan 12, 2010·4 cites·16 claims
- 4468US9795038B2Electronic package design that facilitates shipping the electronic packageINTEL CORP·Filed 2014·Granted Oct 17, 2017·2 cites·10 claims
- 4568US9685388B2Picture frame stiffeners for microelectronic packagesINTEL CORP·Filed 2016·Granted Jun 20, 2017·1 cites·11 claims
- 4666US7166540B2Method for reducing assembly-induced stress in a semiconductor dieINTEL CORP·Filed 2005·Granted Jan 23, 2007·3 cites·16 claims
- 4764US11735558B2Microelectronic structures including bridgesINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·16 claims
- 4864US2021391281A1Warpage control for microelectronics packagesINTEL CORP·Filed 2021·Application pending·0 cites
- 4963US12174436B2Package expanded beam connector for on-package opticsINTEL CORP·Filed 2021·Granted Dec 24, 2024·0 cites·25 claims
- 5063US2024357839A1Memory stacks including replacement blocks and related methodsDESHPANDE NITIN ASHOK·Filed 2024·Application pending·0 cites
Showing the top 50 of 138 patent records by PatentIndex Score.
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