Inventor · disambiguated record
Cheng-Ming Weng
Also filed as: WENG CHENG-MING
7 granted patents·6 pending applications·53 citations·filing 2005–2020
82Inventor score
Top patents by PatentIndex Score
13 records- 0190US7192878B2Method for removing post-etch residue from wafer surfaceUNITED MICROELECTRONICS CORP·Filed 2005·Granted Mar 20, 2007·20 cites·20 claims
- 0289US7378343B2Dual damascence process utilizing teos-based silicon oxide cap layer having reduced carbon contentUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 27, 2008·20 cites·20 claims
- 0374US7628866B2Method of cleaning wafer after etching processUNITED MICROELECTRONICS CORP·Filed 2006·Granted Dec 8, 2009·7 cites·14 claims
- 0470US7214612B2Dual damascene structure and fabrication thereofUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 8, 2007·5 cites·8 claims
- 0557US9320143B2Touch member and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Apr 19, 2016·1 cites·15 claims
- 0657US2016012548A1Automated accounting system and method thereofUNIMICRON TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 0748US2007125750A1Method for removing post-etch residue from wafer surfaceWENG CHENG-MING·Filed 2007·Application pending·0 cites
- 0846US2014151099A1Wiring board and laser drilling method thereofUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 0945US2007080386A1Dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 1044US11745662B2Electrochromic mirror moduleUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Sep 5, 2023·0 cites·19 claims
- 1140US7687446B2Method of removing residue left after plasma processUNITED MICROELECTRONICS CORP·Filed 2006·Granted Mar 30, 2010·0 cites·14 claims
- 1238US2007249165A1Dual damascene processHUANG CHUN-JEN·Filed 2006·Application pending·0 cites
- 1336US2007052107A1Multi-layered structure and fabricating method thereof and dual damascene structure, interconnect structure and capacitorWENG CHENG-MING·Filed 2005·Application pending·0 cites
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