Assignee
WENG CHENG-MING
0 granted patents·2 pending applications·0 citations·filing 2005–2007
Top patents by PatentIndex Score
2 records- 0148US2007125750A1Method for removing post-etch residue from wafer surfaceWENG CHENG-MING·Filed 2007·Application pending·0 cites
- 0236US2007052107A1Multi-layered structure and fabricating method thereof and dual damascene structure, interconnect structure and capacitorWENG CHENG-MING·Filed 2005·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →