Inventor · disambiguated record
Shigeru Tahara
Also filed as: TAHARA SHIGERU
38 granted patents·19 pending applications·229 citations·filing 2002–2024
97Inventor score
Top patents by PatentIndex Score
57 records- 0196US8349085B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2008·Granted Jan 8, 2013·59 cites·7 claims
- 0294US8361275B2Etching apparatusTOKYO ELECTRON LTD·Filed 2012·Granted Jan 29, 2013·14 cites·12 claims
- 0392US7674393B2Etching method and apparatusTOKYO ELECTRON LTD·Filed 2006·Granted Mar 9, 2010·15 cites·10 claims
- 0490USD470885SMarking penKURETAKE CO LTD·Filed 2002·Granted Feb 25, 2003·43 cites·1 claims
- 0589US10861678B2Plasma etching apparatus and methodTOKYO ELECTRON LTD·Filed 2018·Granted Dec 8, 2020·4 cites·15 claims
- 0689US9859102B2Method of etching porous filmTOKYO ELECTRON LTD·Filed 2016·Granted Jan 2, 2018·5 cites·11 claims
- 0788US10770308B2Etching methodTOKYO ELECTRON LTD·Filed 2019·Granted Sep 8, 2020·4 cites·12 claims
- 0888US8852385B2Plasma etching apparatus and methodKOSHIISHI AKIRA·Filed 2007·Granted Oct 7, 2014·12 cites·17 claims
- 0987US10229815B2Plasma etching apparatus and methodTOKYO ELECTRON LTD·Filed 2014·Granted Mar 12, 2019·6 cites·14 claims
- 1086US8986493B2Etching apparatusTOKYO ELECTRON LTD·Filed 2012·Granted Mar 24, 2015·5 cites·10 claims
- 1186US8492287B2Substrate processing methodTAHARA SHIGERU·Filed 2011·Granted Jul 23, 2013·7 cites·13 claims
- 1284US7882800B2Ring mechanism, and plasma processing device using the ring mechanismTOKYO ELECTRON LTD·Filed 2002·Granted Feb 8, 2011·31 cites·32 claims
- 1378US10074800B2Method for etching magnetic layer including isopropyl alcohol and carbon dioxideTOKYO ELECTRON LTD·Filed 2016·Granted Sep 11, 2018·2 cites·6 claims
- 1473US9126229B2Deposit removal methodTAHARA SHIGERU·Filed 2012·Granted Sep 8, 2015·3 cites·8 claims
- 1571US9023733B2Method for block-copolymer lithographyIMEC·Filed 2013·Granted May 5, 2015·2 cites·20 claims
- 1671US8101507B2Semiconductor device manufacturing method and semiconductor device manufacturing apparatusASAKO RYUICHI·Filed 2009·Granted Jan 24, 2012·3 cites·5 claims
- 1770US9786473B2Method of processing workpieceTOKYO ELECTRON LTD·Filed 2016·Granted Oct 10, 2017·1 cites·7 claims
- 1870US8026150B2Semiconductor device manufacturing method and storage mediumTOKYO ELECTRON LTD·Filed 2009·Granted Sep 27, 2011·3 cites·11 claims
- 1966US7892986B2Ashing method and apparatus thereforTOKYO ELECTRON LTD·Filed 2008·Granted Feb 22, 2011·2 cites·4 claims
- 2064US8524101B2Method and apparatus for manufacturing semiconductor device, and storage mediumCHIBA YUKI·Filed 2008·Granted Sep 3, 2013·2 cites·13 claims
- 2163US8614140B2Semiconductor device manufacturing apparatusASAKO RYUICHI·Filed 2011·Granted Dec 24, 2013·1 cites·4 claims
- 2262US9177781B2Plasma processing method and manufacturing method of semiconductor deviceTAHARA SHIGERU·Filed 2011·Granted Nov 3, 2015·1 cites·8 claims
- 2361US9177816B2Deposit removal methodTOKYO ELECTRON LTD·Filed 2014·Granted Nov 3, 2015·1 cites·10 claims
- 2461US8282984B2Processing condition inspection and optimization method of damage recovery process, damage recovering system and storage mediumSASAHARA REIKO·Filed 2008·Granted Oct 9, 2012·2 cites·22 claims
- 2561US7964511B2Plasma ashing methodTOKYO ELECTRON LTD·Filed 2006·Granted Jun 21, 2011·1 cites·14 claims
- 2660US11404283B2Etching methodTOKYO ELECTRON LTD·Filed 2020·Granted Aug 2, 2022·0 cites·6 claims
- 2757US2025079173A1Plasma processing method and plasma processing systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 2855US12131914B2Selective etching with fluorine, oxygen and noble gas containing plasmasTOKYO ELECTRON LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 2955US12068171B2Method for etching oxide semiconductor film and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Aug 20, 2024·0 cites·12 claims
- 3054US10236162B2Method of etching porous filmTOKYO ELECTRON LTD·Filed 2017·Granted Mar 19, 2019·0 cites·4 claims
- 3153US12249515B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Mar 11, 2025·0 cites·16 claims
- 3251US2010116786A1Etching method and apparatusTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
- 3351US2010116787A1Etching method and apparatusTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
- 3451US2009008034A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 3551US2008045030A1Substrate processing method, substrate processing system and storage mediumTAHARA SHIGERU·Filed 2007·Application pending·0 cites
- 3650US11616194B2Etching methodTOKYO ELECTRON LTD·Filed 2019·Granted Mar 28, 2023·0 cites·8 claims
- 3747US11361945B2Plasma processing apparatus, processing system, and method of etching porous filmTOKYO ELECTRON LTD·Filed 2018·Granted Jun 14, 2022·0 cites·20 claims
- 3847US11120999B2Plasma etching methodTOKYO ELECTRON LTD·Filed 2018·Granted Sep 14, 2021·0 cites·7 claims
- 3947US8404596B2Plasma ashing methodTAHARA SHIGERU·Filed 2011·Granted Mar 26, 2013·0 cites·29 claims
- 4047US2009001046A1Substrate processing method, substrate processing apparatus and recording mediumTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 4146US2009188428A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 4246US2015064925A1Deposit removing method and gas processing apparatusTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 4344US9263288B2Etching method using block-copolymersIMEC·Filed 2013·Granted Feb 16, 2016·0 cites·17 claims
- 4443US2013025537A1Processing condition inspection and optimization method of damage recovery process, damage recovering system and storage mediumSASAHARA REIKO·Filed 2012·Application pending·0 cites
- 4541US10825688B2Method for etching copper layerTOKYO ELECTRON LTD·Filed 2017·Granted Nov 3, 2020·0 cites·16 claims
- 4641US2005230351A1Plasma processing method and apparatusTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 4741US2014291289A1Method for etching porous organosilica low-k materialsTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 4840US2012190207A1Plasma processing apparatus and plasma processing methodNISHIMURA EIICHI·Filed 2012·Application pending·0 cites
- 4939US2012270406A1Cleaning method of plasma processing apparatus and plasma processing methodTAHARA SHIGERU·Filed 2012·Application pending·0 cites
- 5039US2005106875A1Plasma ashing methodTOKYO ELECTRON LTD·Filed 2004·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →