Inventor · disambiguated record
Joachim Mahler
Also filed as: MAHLER JOACHIM
203 granted patents·22 pending applications·922 citations·filing 2003–2024
99Inventor score
Files withINFINEON TECHNOLOGIES AG129MAHLER JOACHIM23INFINEON TECHNOLOGIES AUSTRIA12MENGEL MANFRED9HOSSEINI KHALIL8
Top patents by PatentIndex Score
225 records- 0198US9331060B2Device including two power semiconductor chips and manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 3, 2016·48 cites·8 claims
- 0297US9530752B2Method for forming electronic componentsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 27, 2016·37 cites·26 claims
- 0395US8975711B2Device including two power semiconductor chips and manufacturing thereofOTREMBA RALF·Filed 2011·Granted Mar 10, 2015·22 cites·26 claims
- 0495US8884420B1Multichip deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Nov 11, 2014·18 cites·20 claims
- 0594US7767495B2Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric materialINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 3, 2010·31 cites·21 claims
- 0694US7749797B2Semiconductor device having a sensor chip, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 6, 2010·36 cites·23 claims
- 0793US8120158B2Laminate electronic deviceEWE HENRIK·Filed 2009·Granted Feb 21, 2012·28 cites·15 claims
- 0892US9986636B2Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boardsINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 29, 2018·6 cites·6 claims
- 0992US8648456B1Embedded integrated circuit package and method for manufacturing an embedded integrated circuit packageMAHLER JOACHIM·Filed 2012·Granted Feb 11, 2014·13 cites·20 claims
- 1092US7464603B2Sensor component with a cavity housing and a sensor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 16, 2008·26 cites·15 claims
- 1191US9190389B2Chip package with passivesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 17, 2015·13 cites·11 claims
- 1291US8350382B2Semiconductor device including electronic component coupled to a backside of a chipINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 8, 2013·22 cites·9 claims
- 1390US9648735B2Printed circuit boards and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 9, 2017·5 cites·12 claims
- 1490US9048338B2Device including two power semiconductor chips and manufacturing thereofHOSSEINI KHALIL·Filed 2011·Granted Jun 2, 2015·12 cites·5 claims
- 1590US8778733B2Semiconductor package and methods of formation thereofFUERGUT EDWARD·Filed 2012·Granted Jul 15, 2014·11 cites·35 claims
- 1689US8513062B2Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor deviceNIKITIN IVAN·Filed 2010·Granted Aug 20, 2013·9 cites·21 claims
- 1789US7868465B2Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrierINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 11, 2011·18 cites·15 claims
- 1888US7795727B2Semiconductor module having discrete components and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 14, 2010·17 cites·14 claims
- 1988US7642641B2Integrated circuit component with passivation layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 5, 2010·17 cites·11 claims
- 2087US8916968B2Multichip power semiconductor deviceMAHLER JOACHIM·Filed 2012·Granted Dec 23, 2014·8 cites·21 claims
- 2186US9825023B2Insulated gate bipolar transistor comprising negative temperature coefficient thermistorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Nov 21, 2017·6 cites·19 claims
- 2286US7705436B2Semiconductor device with semiconductor chip and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 27, 2010·13 cites·37 claims
- 2385US9006873B2Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 14, 2015·6 cites·9 claims
- 2485US8692361B2Electric device package comprising a laminate and method of making an electric device package comprising a laminateMAHLER JOACHIM·Filed 2012·Granted Apr 8, 2014·7 cites·17 claims
- 2585US7629660B2Semiconductor sensor component including a sensor chip and methods for the manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 8, 2009·14 cites·16 claims
- 2685US7462940B2Semiconductor component comprising flip chip contacts with polymer cores and method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 9, 2008·13 cites·15 claims
- 2785US7443019B2Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 28, 2008·13 cites·13 claims
- 2884US10396007B2Semiconductor package with plateable encapsulant and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·4 cites·13 claims
- 2984US7968378B2Electronic deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 28, 2011·13 cites·25 claims
- 3083US9021887B2Micromechanical semiconductor sensing deviceKALZ FRANZ-PETER·Filed 2011·Granted May 5, 2015·6 cites·3 claims
- 3183US7923350B2Method of manufacturing a semiconductor device including etching to etch stop regionsINFINEON TECHNOLOGIES AG·Filed 2008·Granted Apr 12, 2011·8 cites·11 claims
- 3282US9515243B2Temperature sensorINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 6, 2016·4 cites·31 claims
- 3382US9018742B2Electronic device and a method for fabricating an electronic deviceNIKITIN IVAN·Filed 2012·Granted Apr 28, 2015·6 cites·29 claims
- 3482US7982309B2Integrated circuit including gas phase deposited packaging materialINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 19, 2011·13 cites·18 claims
- 3582US7923823B2Semiconductor device with parylene coatingINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 12, 2011·10 cites·13 claims
- 3682US7847375B2Electronic device and method of manufacturing sameINFINEON TECHNOLOGIES AG·Filed 2008·Granted Dec 7, 2010·10 cites·25 claims
- 3782US7705472B2Semiconductor device with semiconductor device components embedded in a plastic housing compositionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 27, 2010·14 cites·22 claims
- 3881US8866274B2Semiconductor packages and methods of formation thereofGRUBER HERMANN·Filed 2012·Granted Oct 21, 2014·6 cites·46 claims
- 3981US8698298B2Laminate electronic deviceHENRIK EWE·Filed 2012·Granted Apr 15, 2014·9 cites·5 claims
- 4081US8362617B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 29, 2013·9 cites·15 claims
- 4181US7728415B2Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 1, 2010·10 cites·14 claims
- 4280US10978418B2Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layerINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 4380US7843055B2Semiconductor device having an adhesion promoting layer and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 30, 2010·9 cites·20 claims
- 4479US9576944B2Semiconductor devices with transistor cells and thermoresistive elementINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 21, 2017·4 cites·25 claims
- 4579US7781876B2Curing layers of a semiconductor product using electromagnetic fieldsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 24, 2010·8 cites·17 claims
- 4678US10461056B2Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·2 cites·7 claims
- 4778US9420731B2Electronic power device and method of fabricating an electronic power deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Aug 16, 2016·4 cites·12 claims
- 4878US8664043B2Method of manufacturing a laminate electronic device including separating a carrier into a plurality of partsEWE HENRIK·Filed 2009·Granted Mar 4, 2014·6 cites·25 claims
- 4978US7777352B2Semiconductor device with semiconductor device components embedded in plastic package compoundINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 17, 2010·13 cites·27 claims
- 5078US7768107B2Semiconductor component including semiconductor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 3, 2010·8 cites·13 claims
Showing the top 50 of 225 patent records by PatentIndex Score.
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