Inventor · disambiguated record
Hironori Shizuhata
Also filed as: SHIZUHATA HIRONORI
6 granted patents·4 pending applications·12 citations·filing 2007–2015
74Inventor score
Top patents by PatentIndex Score
10 records- 0179US7842551B2Adhesive composition, adhesive sheet and production process for semiconductor deviceLINTEC CORP·Filed 2007·Granted Nov 30, 2010·4 cites·18 claims
- 0272US7674859B2Adhesive composition and adhesive sheetLINTEC CORP·Filed 2008·Granted Mar 9, 2010·6 cites·2 claims
- 0357US7851335B2Adhesive composition, adhesive sheet and production method of semiconductor deviceLINTEC CORP·Filed 2009·Granted Dec 14, 2010·1 cites·12 claims
- 0452US8247503B2Adhesive composition and adhesive sheetSAIKI NAOYA·Filed 2008·Granted Aug 21, 2012·1 cites·2 claims
- 0545US9562179B2Adhesive composition, adhesive sheet and production process for semiconductor deviceLINTEC CORP·Filed 2015·Granted Feb 7, 2017·0 cites·14 claims
- 0644US9184082B2Adhesive composition, adhesive sheet and production process for semiconductor deviceSAIKI NAOYA·Filed 2007·Granted Nov 10, 2015·0 cites·14 claims
- 0744US2009246915A1Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor DeviceLINTEC CORP·Filed 2009·Application pending·0 cites
- 0843US2008242058A1Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor DeviceLINTEC CORP·Filed 2008·Application pending·0 cites
- 0942US2010025837A1Composite semiconductor device, semiconductor package and spacer sheet used in the same, and method for manufacturing composite semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
- 1042US2010090323A1Composite type semiconductor device spacer sheet, semiconductor package using the same, composite type semiconductor device manufacturing method, and composite type semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →